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LPC3250FET296,551

NXP Semiconductors

LPC3250FET296,551 by NXP Semiconductors

NXP Semiconductors' LPC3250FET296,551 is a 32-bit microcontroller with 262144 bytes of RAM and 16384 ROM words. It operates at a max clock frequency of 20 MHz and has 87 I/O lines, making it ideal for industrial applications requiring high-speed processing and extensive input/output capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,820 parts In-Stock

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Vyrian

USA . 4,133 parts In-Stock

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Anansix

USA . 398 parts In-Stock

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398

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Nova Conductors

Japan . 10 parts In-Stock

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Corohmni

South Africa . 952 parts In-Stock

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$6.720

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952

$6.720

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Vigor

Singapore . 4,969 parts In-Stock

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$7.240

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One Stop Electronics

USA . 1,023 parts In-Stock

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$13.000

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AZTECH Wire

Italy . 877 parts In-Stock

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$13.869

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Microchip USA

USA . 378 parts In-Stock

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$18.862

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Semicontronic

India . 1,240 parts In-Stock

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$30.000

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$29.250

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$29.100

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$29.100

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Aztec Data Supply Inc.

USA . 3 parts In-Stock

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$31.630

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QUARKTWIN TECHNOLOGY LTD

USA . 23,173 parts In-Stock

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Continental Prestige Electronics

USA . 3,828 parts In-Stock

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Corphita

USA . 2,741 parts In-Stock

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Argo Parts USA

USA . 1,805 parts In-Stock

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UNI Independent Distributors

Spain . 476 parts In-Stock

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Bastille Electronics

Australia . 26 parts In-Stock

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Overview

Enhance your electronic designs with the LPC3250FET296,551 microcontroller by NXP Semiconductors. Crafted with precision and expertise, this versatile component offers a myriad of applications in various industries. From efficient power management to seamless data processing, this microcontroller provides unparalleled value and benefits to customers seeking high-performance solutions. Trust in NXP Semiconductors for quality products that deliver reliability and innovation every time. Elevate your projects with the LPC3250FET296,551 and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the microcontroller.

Surface Mount: YES

Surface mount technology allows for easy installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 1.39 V

Provides flexibility in power supply options and compatibility with various devices.

Bit Size: 32

32-bit architecture offers enhanced performance and processing capabilities.

Power Supplies (V): 1.3,3.3

Support for multiple power supply voltages enables versatile applications and power management.

No. of Terminals: 296

High number of terminals allows for versatile connectivity options and peripherals.

ADC Channels: YES

Analog-to-digital converter channels enable precise and accurate analog signal measurements.

DMA Channels: YES

Direct memory access channels improve data transfer efficiency and speed.

ROM Words: 16384

Ample Read-Only Memory (ROM) capacity for storing program instructions and data.

Maximum Clock Frequency: 20 MHz

High clock frequency allows for fast processing and responsive performance.

RAM Bytes: 262144

Large Random-Access Memory (RAM) capacity for data storage and processing.

PWM Channels: YES

Pulse-width modulation channels enable precise control of analog outputs such as motor speed or LED brightness.

ROM Programmability: FLASH

Flash programmability allows for easy reprogramming of the microcontroller without the need for specialized equipment.

Technical Specifications

Microcontrollers LPC3250FET296,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B296

JESD-609 Code:

e1

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

87

No. of Terminals:

296

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA296,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

262144

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

266 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.39 V

Minimum Supply Voltage:

1.31 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

15 mm

Peripheral IC Type:

Trade Compliance

LPC3250FET296,551 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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