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LPC3250FET296

NXP Semiconductors

LPC3250FET296 by NXP Semiconductors

LPC3250FET296 by NXP Semiconductors is a 32-bit microcontroller with 262144 bytes of RAM and 16384 ROM words. It features 87 I/O lines, PWM and ADC channels, operates at a max clock frequency of 20 MHz, and has a temperature range from -40 to 85°C. Ideal for industrial applications requiring high-speed processing and extensive I/O capabilities.

Median Price

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Lifecycle Status

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Nova Conductors

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Zilex Electronics Inc.

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AZTECH Wire

Italy . 599 parts In-Stock

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Semicontronic

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Corohmni

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Overview

Looking for a reliable microcontroller for your next project? Look no further than the LPC3250FET296 by NXP Semiconductors. With a reputation for quality and innovation, NXP delivers cutting-edge solutions for a wide range of applications. The LPC3250FET296 offers unparalleled value with its advanced features and high-performance capabilities. Whether you're working on industrial automation, consumer electronics, or IoT devices, this microcontroller is sure to meet your needs. Upgrade your designs with the LPC3250FET296 and experience the difference that NXP Semiconductors can make in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Epoxy is a durable and cost-effective material, making the product sturdy and long-lasting.

Propagation Delay At Nominal Supply: 23.7 ns

Low propagation delay ensures fast signal processing, making the product efficient in time-sensitive applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards.

No. of Functions: 2

Having multiple functions in one component saves space and simplifies circuit design.

Nominal Supply Voltage / Vsup (V): 1.1

Operates at a low voltage, reducing power consumption and heat generation.

Load Capacitance (CL): 30 pF

Suitable for driving loads with moderate capacitance, ensuring signal integrity.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for use in industrial and automotive environments.

Minimum Operating Temperature: -40 °C

Operates efficiently even in extremely cold environments, ideal for outdoor applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Microcontrollers LPC3250FET296 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B296

JESD-609 Code:

e1

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

87

No. of Terminals:

296

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA296,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

262144

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

266 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.39 V

Minimum Supply Voltage:

1.31 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

15 mm

Peripheral IC Type:

Trade Compliance

LPC3250FET296 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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