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LPC3250FET296/01

NXP Semiconductors

LPC3250FET296/01 by NXP Semiconductors

LPC3250FET296/01 by NXP Semiconductors is a 32-bit microcontroller with a max clock frequency of 20 MHz. It features 87 I/O lines, ADC and DMA channels, and flash ROM programmability. This microcontroller is commonly used in industrial applications due to its temperature grade and moisture sensitivity level.

Median Price

$5.627

Lifecycle Status

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Nova Conductors

Japan . 82 parts In-Stock

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Cyclops Electronics Ltd

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Chip Stock

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Digiode

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Anansix

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Prism Electronics

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Fibra_Brandt Electronic GMBH

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Component Sense

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Electronics Depot

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LWI Electronics Inc

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Ampacity Inc.

Singapore . 1,137 parts In-Stock

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Continental Prestige Electronics

USA . 3,165 parts In-Stock

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Corohmni

South Africa . 408 parts In-Stock

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AZTECH Wire

Italy . 831 parts In-Stock

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Semicontronic

India . 1,913 parts In-Stock

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One Stop Electronics

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Aztec Data Supply Inc.

USA . 4,742 parts In-Stock

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Microchip USA

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Argo Parts USA

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Overview

Discover the LPC3250FET296/01 microcontroller by NXP Semiconductors, a game-changing innovation in the field of microcontrollers. With its high-quality manufacturing and advanced technology, this product offers unparalleled performance and reliability. Ideal for various applications, this microcontroller provides customers with exceptional value and benefits. Experience seamless connectivity, efficient data management, and enhanced functionality with the LPC3250FET296/01. Stay ahead of the competition and unlock endless possibilities with this cutting-edge solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection, making it suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, saving space and improving manufacturing efficiency.

Maximum Supply Voltage: 1.39 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power input, providing flexibility in different power supply scenarios.

Address Bus Width: 24

The 24-bit address bus width enables efficient memory addressing, allowing for a larger memory space and more complex computations.

Package Shape: SQUARE

The square package shape simplifies the board layout and provides a compact design, making it suitable for space-constrained applications.

Bit Size: 32

A 32-bit microcontroller offers higher computational capability, enabling faster data processing and better performance.

No. of Terminals: 296

The large number of terminals allows for extensive connectivity options, facilitating the integration of various peripheral devices and expanding functionality.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array package style, along with thin profile and fine pitch, enables efficient soldering and high-density mounting, essential for advanced electronics applications.

Minimum Supply Voltage: 1.31 V

The low minimum supply voltage ensures the microcontroller can operate even with low power sources, making it energy-efficient and suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions, expanding its usability range.

Minimum Operating Temperature: -40 °C

The microcontroller's ability to operate in extremely cold temperatures makes it suitable for applications where temperature fluctuations are common.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of tin/silver/copper terminal finish enhances component reliability, provides excellent solderability, and ensures long-term performance.

ADC Channels: YES

The inclusion of ADC channels allows the microcontroller to convert analog signals into digital data, enabling compatibility with various sensors and analog peripherals.

DMA Channels: YES

Having DMA channels enables efficient and direct data transfer between devices, reducing processor workload and enhancing overall system performance.

Terminal Position: BOTTOM

The placement of terminals on the bottom simplifies PCB layout and enhances component stability during soldering, ensuring reliable connections.

Maximum Seated Height: 1.2 mm

With a maximum seated height of 1.2 mm, this microcontroller can be effectively mounted in compact designs, making it suitable for space-limited applications.

Width: 15 mm

The 15 mm width makes this microcontroller easy to handle and integrate into different electronic systems.

External Data Bus Width: 32

An external data bus width of 32 bits allows for fast and efficient data transfer, enabling smooth communication with external memory and devices.

Maximum Clock Frequency: 20 MHz

The high maximum clock frequency ensures speedy execution of instructions, enabling efficient real-time processing in time-critical applications.

Maximum Time At Peak Reflow Temperature (s): 30

This microcontroller can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering during manufacturing processes.

Peak Reflow Temperature °C: 250

With a peak reflow temperature of 250°C, this microcontroller can withstand high-temperature soldering processes, ensuring proper joint formation.

Length: 15 mm

The 15 mm length makes this microcontroller compatible with various electronic system layouts and suitable for compact designs.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this microcontroller can operate reliably in demanding environments with temperature variations and harsh conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

As a microcontroller with a reduced instruction set computing (RISC) architecture, it offers efficient and optimized processing for embedded control applications.

Technology: CMOS

The use of CMOS (Complementary Metal-Oxide-Semiconductor) technology ensures low power consumption, reliable performance, and compatibility with various digital systems.

Terminal Form: BALL

The ball terminal form provides efficient electrical connections, ensuring reliable signal transmission and enhancing overall system functionality.

Nominal Supply Voltage: 1.35 V

The nominal supply voltage of 1.35V offers stable power input, contributing to the microcontroller's reliable performance and power efficiency.

PWM Channels: YES

The presence of PWM (Pulse Width Modulation) channels allows precise control of analog signals and efficient generation of variable voltage or current outputs.

ROM Programmability: FLASH

The flash ROM programmability feature allows for flexible firmware updates and modifications, enhancing the microcontroller's versatility and adaptability.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8 mm, this microcontroller facilitates precise soldering and reliable connections, ensuring optimal electrical performance.

Moisture Sensitivity Level (MSL): 3

Having an MSL of 3 indicates that the microcontroller has moderate moisture sensitivity, requiring appropriate handling and storage to prevent damage.

Speed: 266 rpm

With a speed of 266 rotations per minute (rpm), this microcontroller provides efficient processing for applications requiring precise rotational control.

No. of I/O Lines: 87

The high number of I/O lines allows for versatile connections to external devices, sensors, and peripherals, expanding the microcontroller's functionality.

Technical Specifications

Microcontrollers LPC3250FET296/01 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATED AT 0.9V AT 14 MHZ

Address Bus Width:

24

Bit Size:

32

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B296

JESD-609 Code:

e1

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

87

No. of Terminals:

296

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

250

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

266 rpm

Maximum Supply Voltage:

1.39 V

Minimum Supply Voltage:

1.31 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

LPC3250FET296/01 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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