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LPC3180FEL320/01,5

NXP Semiconductors

LPC3180FEL320/01,5 by NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 320; Package Code: LFBGA; Package Shape: SQUARE;

Median Price

$13.115

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 411 parts In-Stock

1+ parts

$12.970

100+ parts

$9.360

1k+ parts

-

10k+ parts

-

411

$12.970

$9.360

-

-

Rochester

USA . 411 parts In-Stock

1+ parts

$13.260

100+ parts

$12.460

1k+ parts

$11.270

10k+ parts

-

411

$13.260

$12.460

$11.270

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,621 parts In-Stock

1+ parts

$12.322

100+ parts

-

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-

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4,621

$12.322

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Vyrian

USA . 11,232 parts In-Stock

1+ parts

-

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11,232

-

-

-

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Anansix

USA . 899 parts In-Stock

1+ parts

-

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899

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 949 parts In-Stock

1+ parts

$11.673

100+ parts

-

1k+ parts

-

10k+ parts

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949

$11.673

-

-

-

AZTECH Wire

Italy . 121 parts In-Stock

1+ parts

$11.880

100+ parts

-

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10k+ parts

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121

$11.880

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-

-

Continental Prestige Electronics

USA . 411 parts In-Stock

1+ parts

$12.970

100+ parts

$9.360

1k+ parts

-

10k+ parts

-

411

$12.970

$9.360

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Microchip USA

USA . 316 parts In-Stock

1+ parts

$13.962

100+ parts

-

1k+ parts

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316

$13.962

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$43.114

100+ parts

$42.683

1k+ parts

$40.959

10k+ parts

-

100

$43.114

$42.683

$40.959

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UNI Independent Distributors

Spain . 2,513 parts In-Stock

1+ parts

-

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2,513

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Technical Specifications

Microcontrollers LPC3180FEL320/01,5 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 1.8V OR 3.3V SUPPLY

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B320

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

55

No. of Terminals:

320

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.3 mm

Speed:

208 rpm

Maximum Supply Voltage:

1.3 V

Minimum Supply Voltage:

1.1 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

13 mm

Peripheral IC Type:

Trade Compliance

LPC3180FEL320/01,5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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