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LPC1825JET100E

NXP Semiconductors

LPC1825JET100E by NXP Semiconductors

NXP Semiconductors LPC1825JET100E is a 32-bit microcontroller with Cortex-M3 CPU, operating at up to 25 MHz. It features 139264 bytes of RAM, 786432 ROM words, and supports PWM and ADC channels. Ideal for industrial applications requiring high-speed processing and multiple I/O lines.

Median Price

$11.613

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

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$10.056

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$10.056

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Digiode

USA . 4,364 parts In-Stock

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Anansix

USA . 2,274 parts In-Stock

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Vyrian

USA . 1,981 parts In-Stock

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Flip Electronics

USA . 815 parts In-Stock

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TME

Poland . 215 parts In-Stock

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$13.170

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215

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$13.170

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Distributors (Availability)

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One Stop Electronics

USA . 1,419 parts In-Stock

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$6.000

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Vigor

Singapore . 260 parts In-Stock

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$8.010

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Corohmni

South Africa . 241 parts In-Stock

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$9.968

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Continental Prestige Electronics

USA . 3,914 parts In-Stock

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$10.056

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$9.855

3,914

$10.056

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$9.855

Ampacity Inc.

Singapore . 1,088 parts In-Stock

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$13.000

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AZTECH Wire

Italy . 300 parts In-Stock

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$17.894

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Semicontronic

India . 631 parts In-Stock

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$22.000

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$21.450

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$21.340

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631

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Microchip USA

USA . 2,715 parts In-Stock

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$34.421

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$41.483

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$37.750

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$34.016

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$41.483

$37.750

$34.016

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Perfect Parts

USA . 28,829 parts In-Stock

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UNI Independent Distributors

Spain . 3,401 parts In-Stock

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Corphita

USA . 1,707 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$9.855

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$9.553

10k+ parts

$9.352

1,000

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$9.855

$9.553

$9.352

Argo Parts USA

USA . 260 parts In-Stock

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Overview

Discover the LPC1825JET100E by NXP Semiconductors, a top-tier microcontroller that guarantees top-notch quality and reliability. With its cutting-edge technology and versatile applications in various industries, this product offers unparalleled value and benefits to customers looking for high-performance solutions. Experience seamless operation and unmatched efficiency with the LPC1825JET100E, setting new standards in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and thermal resistance for the package, ensuring reliability in various operating conditions.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of applications.

Bit Size: 32

32-bit architecture enables high computational performance and efficient processing of data, making the microcontroller suitable for complex tasks.

CPU Family: CORTEX-M3

CORTEX-M3 architecture offers a good balance between performance and power efficiency, making it ideal for embedded applications.

RAM Bytes: 139264

Large RAM capacity allows for efficient data storage and manipulation, enhancing the microcontroller's capability to handle multiple tasks simultaneously.

Maximum Clock Frequency: 25 MHz

High clock frequency enables fast execution of instructions and tasks, improving overall system performance.

ADC Channels: YES

Integrated ADC channels allow for analog signal conversion, enabling the microcontroller to interface with various sensors and external devices.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers simplified instruction set and streamlined execution, enhancing the microcontroller's efficiency in processing tasks.

ROM Programmability: FLASH

Flash programmability allows for easy reprogramming and updating of the microcontroller's firmware, leading to greater flexibility and adaptability in applications.

Technical Specifications

Microcontrollers LPC1825JET100E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B100

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

49

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

139264

ROM Words:

786432

ROM Programmability:

FLASH

Speed:

180 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

9 mm

Peripheral IC Type:

Trade Compliance

LPC1825JET100E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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