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LPC1822JET100E

NXP Semiconductors

LPC1822JET100E by NXP Semiconductors

NXP Semiconductors' LPC1822JET100E is a 32-bit microcontroller with 524288 ROM words, 106496 RAM bytes, and 49 I/O lines. Operating at up to 25 MHz, it's ideal for industrial applications requiring a peak temperature of 260°C. Featuring ADC and DMA channels, this Cortex-M3 CPU family device offers versatile performance in a compact square package.

Median Price

$12.633

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 260 parts In-Stock

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$16.100

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$10.978

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$10.260

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Verical

USA . 9,880 parts In-Stock

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$9.166

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Flip Electronics

USA . 878 parts In-Stock

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$6.420

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Digiode

USA . 3,524 parts In-Stock

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$13.357

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Vyrian

USA . 4,695 parts In-Stock

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Anansix

USA . 1,416 parts In-Stock

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Nova Conductors

Japan . 89 parts In-Stock

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Modulus Dynamics

Lithuania . 3,085 parts In-Stock

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$11.557

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$11.557

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$11.557

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Corohmni

South Africa . 317 parts In-Stock

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$11.557

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Ampacity Inc.

Singapore . 441 parts In-Stock

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$11.950

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Semicontronic

India . 237 parts In-Stock

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$11.950

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$11.651

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$11.592

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Corphita

USA . 3,302 parts In-Stock

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$12.654

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QUARKTWIN TECHNOLOGY LTD

USA . 15,252 parts In-Stock

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Microchip USA

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UNI Independent Distributors

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Argo Parts USA

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Continental Prestige Electronics

USA . 1,936 parts In-Stock

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Authorized Procurement Solutions

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Perfect Parts

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Aranea Global

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Overview

Unleash the power of innovation with the LPC1822JET100E by NXP Semiconductors. As a leader in the microcontroller industry, NXP delivers top-notch quality and reliability. This versatile device offers endless possibilities for applications in various industries, providing customers with unmatched value and performance. Say goodbye to limitations and hello to endless opportunities with the LPC1822JET100E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging a microcontroller.

Surface Mount: YES

Easily mountable on PCBs for efficient circuit design.

Maximum Supply Voltage: 3.6 V

Allows for higher voltage operation, increasing versatility.

Bit Size: 32

Offers a good balance between processing power and complexity for various applications.

No. of I/O Lines: 49

Sufficient number of input/output lines for connecting external components and peripherals.

ROM Words: 524288

Large memory capacity for storing programs and data.

RAM Bytes: 106496

Sizable RAM for temporary data storage and processing.

Maximum Clock Frequency: 25 MHz

Decent clock speed for responsive real-time applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient processing of instructions.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments with wide temperature range support.

ADC Channels: YES

Analog-to-digital converter channels for interfacing with analog sensors.

DMA Channels: YES

Direct Memory Access channels for efficient data transfers and processing.

Technical Specifications

Microcontrollers LPC1822JET100E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B100

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

49

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

106496

ROM Words:

524288

ROM Programmability:

FLASH

Speed:

180 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

9 mm

Peripheral IC Type:

Trade Compliance

LPC1822JET100E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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