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LPC1778FET208,551

NXP Semiconductors

LPC1778FET208,551 by NXP Semiconductors

NXP Semiconductors' LPC1778FET208,551 is a 32-bit microcontroller with Cortex-M3 CPU, 165 I/O lines, and 26-bit address bus width. It operates at a max clock frequency of 25 MHz and has DAC/ADC channels for precise analog signal processing. Ideal for industrial applications requiring high-speed data processing and control capabilities.

Median Price

$9.750

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 39 parts In-Stock

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-

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$9.750

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$8.720

10k+ parts

$8.210

39

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$9.750

$8.720

$8.210

Distributors (In-Stock)

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Digiode

USA . 136 parts In-Stock

1+ parts

$9.348

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136

$9.348

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Vyrian

USA . 4,221 parts In-Stock

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Flip Electronics

USA . 2,142 parts In-Stock

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Nova Conductors

Japan . 700 parts In-Stock

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Anansix

USA . 532 parts In-Stock

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532

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Distributors (Availability)

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Corohmni

South Africa . 106 parts In-Stock

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$8.340

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Corphita

USA . 1,744 parts In-Stock

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$8.856

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1,744

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AZTECH Wire

Italy . 238 parts In-Stock

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$9.860

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238

$9.860

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Semicontronic

India . 63 parts In-Stock

1+ parts

$18.200

100+ parts

$17.745

1k+ parts

$17.654

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63

$18.200

$17.745

$17.654

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Ampacity Inc.

Singapore . 53 parts In-Stock

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$18.200

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Aztec Data Supply Inc.

USA . 93 parts In-Stock

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$18.600

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$34.120

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$31.049

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$27.978

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100

$34.120

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$27.978

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Microchip USA

USA . 5,993 parts In-Stock

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$50.316

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Perfect Parts

USA . 31,193 parts In-Stock

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Lixinc

USA . 8,047 parts In-Stock

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Continental Prestige Electronics

USA . 5,760 parts In-Stock

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UNI Independent Distributors

Spain . 3,590 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Argo Parts USA

USA . 1,019 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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Overview

Upgrade your electronics projects with the LPC1778FET208,551 by NXP Semiconductors. As a leading manufacturer in the industry, NXP guarantees top-quality microcontrollers that deliver exceptional performance and reliability. Perfect for a wide range of applications, this product offers advanced features such as DAC and ADC channels, DMA support, and PWM capabilities. With its cutting-edge technology and industrial-grade temperature tolerance, the LPC1778FET208,551 provides unmatched value, flexibility, and efficiency for your designs. Experience the difference with NXP Semiconductors today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it a reliable choice for various applications.

Surface Mount: YES

This feature allows for easy integration onto circuit boards, saving time and effort during installation.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power sources, increasing its versatility.

Address Bus Width: 26

The large address bus width allows for efficient memory access, enhancing the overall performance of the microcontroller.

Package Shape: SQUARE

The square shape of the package design optimizes space utilization, making it suitable for compact designs.

Bit Size: 32

The 32-bit architecture provides advanced processing capabilities, making it suitable for complex tasks and applications.

DAC Channels: YES

Integrated DAC channels enable precise analog signal generation, ideal for audio and sensor applications.

Power Supplies (V): 3.3

The standardized power supply voltage ensures compatibility with common power sources, simplifying the design process.

No. of Terminals: 208

The high number of terminals allows for a wide range of connections and peripherals, increasing the microcontroller's functionality.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This package style offers a compact and robust design suitable for modern electronic devices.

Minimum Supply Voltage: 2.4 V

With a low minimum supply voltage, this microcontroller can operate efficiently even with limited power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in harsh environments, making it suitable for industrial applications.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family offers high performance and energy efficiency, making it a popular choice for microcontroller applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this microcontroller to function reliably in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

ADC Channels: YES

Integrated ADC channels enable accurate analog-to-digital conversion, essential for sensor interfacing and data acquisition.

DMA Channels: YES

DMA channels allow for efficient data transfer between peripherals and memory, optimizing system performance.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and ensures secure connections in the system design.

ROM Words: 524288

The large ROM capacity provides ample storage for program code, enabling the implementation of complex algorithms.

Maximum Seated Height: 1.2 mm

The low seated height of the package design minimizes the overall profile of the system, ideal for space-constrained applications.

Width: 15 mm

The compact width of the microcontroller makes it suitable for small form factor designs without compromising functionality.

External Data Bus Width: 32

The wide external data bus width allows for efficient data transfer between the microcontroller and external memory devices.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency enables fast processing speeds, enhancing the overall performance of the microcontroller.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures proper soldering during assembly, reducing the risk of thermal damage to the microcontroller.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for reliable soldering processes, ensuring robust connections on the PCB.

Length: 15 mm

The compact length of the microcontroller contributes to space-efficient designs, suitable for compact electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environments, making it ideal for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

This microcontroller features a RISC architecture, offering high-speed processing and low power consumption for efficient operation.

RAM Bytes: 98304

The large RAM capacity provides ample memory for data storage and processing, enabling the execution of complex algorithms.

Technology: CMOS

The CMOS technology used in this microcontroller ensures low power consumption and high noise immunity, ideal for battery-powered devices.

Terminal Form: BALL

The ball terminal form simplifies soldering processes and ensures secure connections in the system design.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage ensures stable operation and compatibility with common power sources, simplifying system design.

PWM Channels: YES

Integrated PWM channels enable precise control of digital signals, essential for motor control and power management applications.

ROM Programmability: FLASH

The flash programmability of the ROM allows for easy reprogramming of code, facilitating firmware updates and customization.

Terminal Pitch: 0.8 mm

The fine terminal pitch simplifies PCB layout and assembly, ensuring secure connections and efficient routing.

Moisture Sensitivity Level (MSL): 2

The MSL rating indicates the level of moisture sensitivity, ensuring proper handling and storage of the microcontroller during assembly.

Speed: 120 rpm

The high speed capability of the microcontroller enables fast data processing and real-time control, suitable for demanding applications.

No. of I/O Lines: 165

The high number of I/O lines provides flexibility for interfacing with external devices and peripherals, enhancing the microcontroller's capabilities.

Technical Specifications

Microcontrollers LPC1778FET208,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B208

JESD-609 Code:

e1

Length:

15 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

165

No. of Terminals:

208

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA208,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

120 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

LPC1778FET208,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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