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LPC1778FBD208,551

NXP Semiconductors

LPC1778FBD208,551 by NXP Semiconductors

NXP Semiconductors' LPC1778FBD208,551 is a 32-bit microcontroller with Cortex-M3 CPU, 165 I/O lines, and 98304 bytes of RAM. It operates at a max clock frequency of 25 MHz and has ADC/DAC channels for analog signal processing. Ideal for industrial applications requiring high-speed data processing in compact designs.

Median Price

$7.170

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,057 parts In-Stock

1+ parts

$7.170

100+ parts

$7.030

1k+ parts

$6.880

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2,057

$7.170

$7.030

$6.880

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,191 parts In-Stock

1+ parts

$6.812

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4,191

$6.812

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Nova Conductors

Japan . 52 parts In-Stock

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$7.166

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52

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Vyrian

USA . 2,721 parts In-Stock

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2,721

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Anansix

USA . 165 parts In-Stock

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165

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Cogito LLC

Ukraine . 30 parts In-Stock

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30

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Rebound Electronics

UK . 23 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,989 parts In-Stock

1+ parts

$6.090

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1,989

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Corphita

USA . 3,803 parts In-Stock

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$6.453

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3,803

$6.453

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Continental Prestige Electronics

USA . 4,231 parts In-Stock

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$7.166

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$7.023

4,231

$7.166

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$7.023

AZTECH Wire

Italy . 1,035 parts In-Stock

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$21.660

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Perfect Parts

USA . 393,926 parts In-Stock

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Lixinc

USA . 16,345 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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UNI Independent Distributors

Spain . 3,246 parts In-Stock

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Argo Parts USA

USA . 1,811 parts In-Stock

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iodParts Technologies Inc.

India . 18 parts In-Stock

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Overview

Unleash the power of innovation with the LPC1778FBD208,551 by NXP Semiconductors! This cutting-edge microcontroller boasts top-tier quality and reliability, making it the go-to choice for a wide range of applications. From industrial automation to consumer electronics, this versatile device offers unparalleled value and performance. Say goodbye to limitations and hello to endless possibilities with the LPC1778FBD208,551 - the ultimate solution for your next project!

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material is lightweight and durable, making the product suitable for a wide range of applications.

Surface Mount:

YES - This feature allows for easy installation and space-saving on PCBs, making it convenient for compact designs.

Maximum Supply Voltage:

3.6 V - The high maximum supply voltage provides flexibility in power input options for different project requirements.

Address Bus Width:

26 - The wide address bus width allows for efficient data transmission and processing, enhancing overall performance.

Package Shape:

SQUARE - The square package shape offers a balanced and symmetrical layout for better organization and placement on a circuit board.

Bit Size:

32 - The 32-bit architecture enables fast and efficient processing of data, making the product suitable for demanding tasks.

DAC Channels:

YES - The inclusion of DAC channels allows for accurate and precise analog signal generation, ideal for applications requiring high-quality output.

Power Supplies (V):

3.3 - The stable power supply voltage ensures reliable operation of the microcontroller in various conditions.

No. of Terminals:

208 - The ample number of terminals provides flexibility and connectivity options, accommodating a wide range of peripheral devices.

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH - This package style offers a compact and space-efficient design, suitable for miniaturized electronics applications.

Minimum Supply Voltage:

2.4 V - The low minimum supply voltage allows for energy-efficient operation and compatibility with a wide range of power sources.

Maximum Operating Temperature:

85 °C - The high maximum operating temperature tolerance ensures the microcontroller can withstand elevated temperatures in industrial environments.

CPU Family:

CORTEX-M3 - The use of the Cortex-M3 CPU family signifies high performance and energy efficiency, making it an excellent choice for embedded systems.

Minimum Operating Temperature:

40 °C - The low minimum operating temperature rating ensures reliable operation even in harsh environmental conditions.

Terminal Finish:

TIN - The terminal finish with TIN provides good solderability and conductivity for secure connections on the PCB.

ADC Channels:

YES - The built-in ADC channels enable analog to digital conversion functionality, essential for capturing and processing real-world data.

DMA Channels:

YES - The presence of DMA channels allows for efficient data transfer between memory and peripherals, enhancing overall system performance.

Terminal Position:

QUAD - The quad terminal position enables easy and secure mounting on the PCB, ensuring stability and reliability in operation.

ROM Words:

524288 - The large ROM capacity of 524288 words provides ample storage for program code and data, suitable for complex applications.

Maximum Seated Height:

1.6 mm - The low maximum seated height offers a slim profile and space-saving design, ideal for compact electronic devices.

Width:

28 mm - The moderate width of 28mm provides a balance between space efficiency and component placement flexibility on the PCB.

External Data Bus Width:

32 - The wide external data bus width of 32 bits allows for fast and efficient data transfer between the microcontroller and external devices.

Maximum Clock Frequency:

25 MHz - The high maximum clock frequency supports fast processing speeds, making the microcontroller suitable for high-performance applications.

Maximum Time At Peak Reflow Temperature (s):

30 - The lengthy reflow time ensures proper soldering and component bonding during assembly processes.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature tolerance ensures the microcontroller can withstand the soldering process without damage.

Length:

28 mm - The moderate length of 28mm offers a balanced layout and compatibility with standard PCB sizes.

Temperature Grade:

INDUSTRIAL - The industrial temperature grade designation indicates the microcontroller's reliability and suitability for rugged environments.

Peripheral IC Type:

MICROCONTROLLER, RISC - The microcontroller with RISC-based peripheral IC type offers efficient processing and reduced power consumption, ideal for battery-operated devices.

RAM Bytes:

98304 - The ample RAM capacity of 98304 bytes provides sufficient memory for data storage and processing requirements in diverse applications.

Technology:

CMOS - The CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form:

GULL WING - The gull wing terminal form provides mechanical stability and ease of soldering during PCB assembly, ensuring secure connections.

Nominal Supply Voltage:

3.3 V - The nominal supply voltage of 3.3V ensures stable and consistent power delivery, essential for reliable operation in electronic devices.

PWM Channels:

YES - The availability of PWM channels allows for precise control of analog devices, such as motors and LEDs, enhancing functionality and performance.

ROM Programmability:

FLASH - The flash ROM programmability offers reprogrammable memory capability, allowing for firmware updates and customization as needed.

Terminal Pitch:

0.5 mm - The fine terminal pitch of 0.5mm enables high-density mounting and interconnectivity on the PCB, suitable for compact designs.

Moisture Sensitivity Level (MSL):

2 - The moisture sensitivity level of 2 indicates the microcontroller's tolerance to moisture exposure during storage and handling.

Speed:

120 rpm - The high rotational speed of 120 rpm provides fast data processing and response times, ideal for time-sensitive applications.

No. of I/O Lines:

165 - The generous number of I/O lines allows for versatile interfacing and connectivity options, accommodating a variety of external devices and peripherals.

Technical Specifications

Microcontrollers LPC1778FBD208,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G208

JESD-609 Code:

e3

Length:

28 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

165

No. of Terminals:

208

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP208,1.2SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

28 mm

Peripheral IC Type:

Trade Compliance

LPC1778FBD208,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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