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LPC1777FBD208,551

NXP Semiconductors

LPC1777FBD208,551 by NXP Semiconductors

NXP Semiconductors' LPC1777FBD208,551 is a 32-bit microcontroller with Cortex-M3 CPU family. It features 26-bit address bus width, 32-bit external data bus width, and operates at a max clock frequency of 25 MHz. Ideal for industrial applications requiring high-speed processing and multiple ADC/DAC channels.

Median Price

$15.468

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 327 parts In-Stock

1+ parts

$11.128

100+ parts

$10.677

1k+ parts

$9.359

10k+ parts

-

327

$11.128

$10.677

$9.359

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Arrow

USA . 283 parts In-Stock

1+ parts

$12.849

100+ parts

$10.043

1k+ parts

$9.444

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-

283

$12.849

$10.043

$9.444

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DigiKey

USA . 22 parts In-Stock

1+ parts

$18.560

100+ parts

$13.486

1k+ parts

$11.955

10k+ parts

-

22

$18.560

$13.486

$11.955

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Mouser Electronics

USA . 5 parts In-Stock

1+ parts

$18.560

100+ parts

$13.490

1k+ parts

$11.870

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5

$18.560

$13.490

$11.870

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EBV Elektronik

Germany . 252 parts In-Stock

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Rochester

USA . 63 parts In-Stock

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$10.310

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$9.220

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$8.680

63

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$10.310

$9.220

$8.680

Verical

USA . 30 parts In-Stock

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-

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$18.087

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30

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$18.087

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Distributors (In-Stock)

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Digiode

USA . 3,661 parts In-Stock

1+ parts

$9.526

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3,661

$9.526

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Vyrian

USA . 3,909 parts In-Stock

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3,909

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Anansix

USA . 1,887 parts In-Stock

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DigiKey Marketplace

USA . 773 parts In-Stock

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Semi Source

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Distributors (Availability)

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Corphita

USA . 2,628 parts In-Stock

1+ parts

$9.024

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$9.024

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GreenTree Electronics

Israel . 30,000 parts In-Stock

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Lixinc

USA . 18,270 parts In-Stock

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Microchip USA

USA . 10,043 parts In-Stock

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10,043

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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UNI Independent Distributors

Spain . 8,018 parts In-Stock

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Perfect Parts

USA . 1,452 parts In-Stock

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Infinite Electronics LLP (Excess)

. 689 parts In-Stock

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689

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Overview

Discover the LPC1777FBD208,551 by NXP Semiconductors, a cutting-edge microcontroller that offers unparalleled quality and reliability. Ideal for a wide range of applications, this innovative device boasts advanced features such as DAC and ADC channels, PWM capabilities, and powerful ROM programmability. With NXP Semiconductors' reputation for excellence in semiconductor manufacturing, you can trust that this microcontroller will deliver exceptional performance. Experience the value and benefits of the LPC1777FBD208,551 today and elevate your projects to new heights of efficiency and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, making it suitable for a variety of environments.

Surface Mount: YES

Surface mount design allows for easy installation and integration on printed circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

A higher maximum supply voltage allows for versatility in power supply options and compatibility with various systems.

Address Bus Width: 26

The wide address bus width of 26 enables efficient data processing and communication within the microcontroller.

Package Shape: SQUARE

Square package shape offers uniformity and ease of handling during manufacturing and assembly processes.

Bit Size: 32

32-bit architecture provides enhanced processing capabilities, making the microcontroller suitable for complex applications that require high performance.

DAC Channels: YES

Digital-to-analog converter (DAC) channels enable the microcontroller to generate analog signals, expanding its functionality for a wide range of applications.

Power Supplies (V): 3.3

Stable power supply at 3.3V ensures reliable operation of the microcontroller and compatibility with common voltage standards.

No. of Terminals: 208

A high number of terminals allow for versatile connectivity options and interfaces with external devices, enhancing the microcontroller's utility.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style offers compactness and efficiency in design, making the microcontroller suitable for space-constrained applications.

Technical Specifications

Microcontrollers LPC1777FBD208,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G208

JESD-609 Code:

e3

Length:

28 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

165

No. of Terminals:

208

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP208,1.2SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

28 mm

Peripheral IC Type:

Trade Compliance

LPC1777FBD208,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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