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LPC1766FBD100,551

NXP Semiconductors

LPC1766FBD100,551 by NXP Semiconductors

NXP Semiconductors' LPC1766FBD100,551 is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. It features 8-Ch 12-Bit ADC channels, CAN, ETHERNET, I2C, UART connectivity options. Ideal for industrial applications due to its -40 to 85 °C operating temperature range and various peripherals like BOD, PWM(6), RTC.

Median Price

$6.340

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

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$6.340

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100

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Vyrian

USA . 6,256 parts In-Stock

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Anansix

USA . 1,195 parts In-Stock

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Digiode

USA . 482 parts In-Stock

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Flip Electronics

USA . 127 parts In-Stock

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ComSIT Distribution GmbH

Germany . 40 parts In-Stock

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One Stop Electronics

USA . 1,610 parts In-Stock

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$3.000

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Continental Prestige Electronics

USA . 5,372 parts In-Stock

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$6.213

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Netroflash

USA . 1,000 parts In-Stock

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$6.340

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AZTECH Wire

Italy . 421 parts In-Stock

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$16.201

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Ampacity Inc.

Singapore . 1,238 parts In-Stock

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$29.000

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Aztec Data Supply Inc.

USA . 2,140 parts In-Stock

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$30.530

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Semicontronic

India . 3,334 parts In-Stock

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$34.125

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$33.950

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Microchip USA

USA . 2,450 parts In-Stock

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$86.780

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Lixinc

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Authorized Procurement Solutions

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UNI Independent Distributors

Spain . 6,519 parts In-Stock

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S.R.D Solutions

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Futuretech Components

Singapore . 4,950 parts In-Stock

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Argo Parts USA

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Corohmni

South Africa . 1,796 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,703 parts In-Stock

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Advanced Electronics

New Zealand . 700 parts In-Stock

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Corphita

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Overview

Discover the LPC1766FBD100,551 by NXP Semiconductors, a powerful microcontroller designed for industrial-grade applications. With cutting-edge technology and a wide range of peripherals including CAN, Ethernet, and UART, this Cortex-M3 CPU family member offers unmatched performance and reliability. Benefit from its low profile package, high-speed operation, and extensive memory options for seamless integration into your next project. Trust in NXP Semiconductors' reputation for quality and innovation, and unlock endless possibilities with the LPC1766FBD100,551. Elevate your designs with this exceptional microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a wide range of applications without adding unnecessary weight.

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB designs, saving space and reducing assembly costs.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power supply options and compatibility with a variety of systems.

Bit Size: 32

The 32-bit architecture enables faster processing speed and improved performance for complex applications.

DAC Channels: YES

Digital-to-analog converters provide the ability to interface with analog systems, expanding the range of applications for the product.

No. of Terminals: 100

The large number of terminals allows for versatile connectivity options and integration with external components for enhanced functionality.

CPU Family: CORTEX-M3

The Cortex-M3 architecture offers high-performance computing capabilities and energy efficiency, making the product ideal for power-sensitive applications.

ADC Channels: YES

Analog-to-digital converters enable the product to interface with sensors and other analog devices, making it suitable for a wide range of applications.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and offload the CPU, enhancing the overall performance of the product.

ROM Words: 262144

The large ROM capacity allows for storing a significant amount of program data and instructions, enabling complex applications to be implemented.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture offers efficient processing and reduced power consumption, making the product suitable for battery-powered applications.

Technical Specifications

Microcontrollers LPC1766FBD100,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

70

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3,3/3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

100 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), ETHERNET, I2C(3), I2S, SSP, UART(4)

Peripherals:

BOD, COMPARATOR, DMA(8), PWM(6), RTC, TIMER(6), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

LPC1766FBD100,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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