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LPC11U35FHI33/501Y

NXP Semiconductors

LPC11U35FHI33/501Y by NXP Semiconductors

NXP Semiconductors' LPC11U35FHI33/501Y is a 32-bit microcontroller with 26 I/O lines, ADC and DMA channels. Operating at 25 MHz, it supports a supply voltage range of 1.8V to 3.6V, making it ideal for applications requiring high-speed data processing in compact designs like IoT devices and consumer electronics.

Median Price

$4.062

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 11,675 parts In-Stock

1+ parts

$4.470

100+ parts

$3.260

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-

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11,675

$4.470

$3.260

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Flip Electronics (Authorized)

USA . 1,613 parts In-Stock

1+ parts

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1,613

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Verical

USA . 1,560 parts In-Stock

1+ parts

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100+ parts

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$3.654

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1,560

-

-

$3.654

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$3.400

100+ parts

-

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500

$3.400

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Digiode

USA . 3,735 parts In-Stock

1+ parts

$4.351

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3,735

$4.351

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Vyrian

USA . 7,232 parts In-Stock

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7,232

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Anansix

USA . 2,037 parts In-Stock

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2,037

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Flip Electronics

USA . 1,613 parts In-Stock

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1,613

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 3,743 parts In-Stock

1+ parts

$3.400

100+ parts

-

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3,743

$3.400

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Continental Prestige Electronics

USA . 2,327 parts In-Stock

1+ parts

$3.400

100+ parts

-

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$3.332

2,327

$3.400

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$3.332

Netroflash

USA . 500 parts In-Stock

1+ parts

$3.400

100+ parts

-

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500

$3.400

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Corphita

USA . 3,688 parts In-Stock

1+ parts

$4.122

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3,688

$4.122

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AZTECH Wire

Italy . 523 parts In-Stock

1+ parts

$16.270

100+ parts

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523

$16.270

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Aztec Data Supply Inc.

USA . 3,252 parts In-Stock

1+ parts

$18.829

100+ parts

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3,252

$18.829

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Microchip USA

USA . 8,469 parts In-Stock

1+ parts

$23.778

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8,469

$23.778

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Corohmni

South Africa . 46 parts In-Stock

1+ parts

$30.755

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46

$30.755

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QUARKTWIN TECHNOLOGY LTD

USA . 10,315 parts In-Stock

1+ parts

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10,315

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UNI Independent Distributors

Spain . 72 parts In-Stock

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72

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Overview

Elevate your projects with the LPC11U35FHI33/501Y microcontroller from NXP Semiconductors. Known for their top-notch quality and reliability, NXP Semiconductors delivers cutting-edge technology that sets the standard in the industry. Whether you're working on IoT devices, consumer electronics, or industrial applications, this microcontroller offers unmatched value, performance, and flexibility. Stay ahead of the curve and unlock endless possibilities with the LPC11U35FHI33/501Y microcontroller.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, making this microcontroller easy to integrate into electronic devices.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage of 3.6 V provides flexibility and compatibility with a wide range of power sources.

Package Shape: SQUARE

The square package shape is space-efficient and allows for easy placement on the PCB, optimizing board layout.

Bit Size: 32

The 32-bit architecture provides high processing power and efficiency, suitable for handling complex tasks and calculations.

No. of Terminals: 32

With 32 terminals, this microcontroller offers a sufficient number of connections for interfacing with external components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style options provide versatility and compatibility with different mounting and heat dissipation requirements.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage of 1.8 V allows for power-efficient operation and extends battery life in portable applications.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, making this microcontroller suitable for interfacing with analog sensors and signals.

DMA Channels: YES

DMA channels support direct memory access, enhancing data transfer speeds and efficiency in data-intensive applications.

Terminal Position: QUAD

The quad terminal position simplifies routing and connectivity on the PCB, improving signal integrity and reducing interference.

Width: 5 mm

The compact 5 mm width allows for space-saving integration in small form factor devices or densely populated PCB designs.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency of 25 MHz enables fast processing speeds and real-time operation in time-critical applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable soldering and durability during assembly processes.

Length: 5 mm

The 5 mm length provides a compact footprint, ideal for applications with limited space constraints or size requirements.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of this microcontroller offers efficient instruction execution and high performance, suitable for a wide range of applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the soldering process and reduces the risk of soldering defects or short circuits.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V is commonly used in electronic systems, ensuring compatibility with standard power sources.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm allows for high-density mounting and efficient use of PCB space, suitable for miniaturized designs.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates the handling and storage requirements for the microcontroller, ensuring proper moisture resistance and reliability.

Speed: 50 rpm

While rpm typically refers to rotational speed, a speed of 50 rpm may relate to a specific operation or control parameter of this microcontroller.

No. of I/O Lines: 26

With 26 I/O lines, this microcontroller offers versatile interfacing options for connecting to external devices, sensors, and communication interfaces.

Technical Specifications

Microcontrollers LPC11U35FHI33/501Y attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

26

No. of Terminals:

32

PWM Channels:

NO

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Speed:

50 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Trade Compliance

LPC11U35FHI33/501Y Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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