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LPC11E68JBD64E

NXP Semiconductors

LPC11E68JBD64E by NXP Semiconductors

NXP Semiconductors' LPC11E68JBD64E is a 32-bit microcontroller with 3.3V supply, 25 MHz clock frequency, and 262144 ROM words. Ideal for industrial applications, it features 12-Ch ADCs, 6 PWM channels, and connectivity options like I2C and USART for efficient data processing.

Median Price

$3.830

Lifecycle Status

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8

In-Stock Inventory

1k+

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Rochester

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Chip Stock

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Modulus Dynamics

Lithuania . 195 parts In-Stock

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Corohmni

South Africa . 43 parts In-Stock

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Vigor

Singapore . 1,338 parts In-Stock

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Semicontronic

India . 65 parts In-Stock

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Microchip USA

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AZTECH Wire

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Overview

Unlock the potential of your next project with the LPC11E68JBD64E microcontroller by NXP Semiconductors. Harnessing the power of the CORTEX-M0 CPU family, this 32-bit marvel offers a wide range of peripherals and features such as DMA channels, PWM, and ADC, ensuring seamless connectivity and functionality. Whether you're designing IoT devices, consumer electronics, or industrial controls, this industrial-grade microcontroller delivers exceptional performance and reliability. Embrace innovation and elevate your designs with the LPC11E68JBD64E today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in microcontrollers due to its durability and cost-effectiveness.

Surface Mount: YES

Surface mount technology allows for smaller and more compact designs, making this product suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage provides flexibility in power supply options for the microcontroller.

Bit Size: 32

A 32-bit architecture allows for faster and more efficient processing of data, making this microcontroller suitable for complex tasks.

Power Supplies (V): 3.3

The 3.3V power supply is a common standard in electronics, ensuring compatibility with other components and systems.

No. of Terminals: 64

Having more terminals allows for greater connectivity options and more interfaces for external devices.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature makes this microcontroller suitable for industrial applications where heat may be a concern.

CPU Family: CORTEX-M0

The Cortex-M0 architecture is known for its energy efficiency and low power consumption, making this microcontroller ideal for battery-powered devices.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable performance even in extreme cold environments.

ADC Channels: YES

Analog to Digital Converter (ADC) channels enable the microcontroller to interface with analog sensors and signals, expanding its capabilities.

DMA Channels: YES

Direct Memory Access (DMA) channels allow for efficient data transfer between peripherals and memory, improving overall system performance.

ROM Words: 262144

With a large ROM size, this microcontroller can store a significant amount of program data and instructions.

Data EEPROM Size: 4096

The EEPROM size allows for non-volatile data storage, retaining information even when the power is turned off.

Maximum Clock Frequency: 25 MHz

A high maximum clock frequency ensures fast processing speeds and responsive performance.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture is known for its simplicity and efficiency, making this microcontroller a good choice for real-time applications.

RAM Bytes: 36864

With a large RAM size, this microcontroller can handle multiple tasks simultaneously and store temporary data efficiently.

Analog To Digital Convertors: 12-Ch 12-Bit

Having 12 analog to digital converters with 12-bit resolution allows for accurate and precise analog signal processing.

PWM Channels: YES

Pulse Width Modulation (PWM) channels enable the microcontroller to control power output with precision, useful for motor control and LED dimming.

Connectivity: I2C(2), SSP(2), USART(4)

Multiple communication interfaces like I2C, SPI, and UART provide flexibility in connecting to external devices and peripherals.

Moisture Sensitivity Level (MSL): 2

The MSL rating indicates how sensitive the microcontroller is to moisture during storage and handling, ensuring reliability in various environmental conditions.

Technical Specifications

Microcontrollers LPC11E68JBD64E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

50

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

36864

ROM Words:

262144

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

4096

Connectivity:

I2C(2), SSP(2), USART(4)

Peripherals:

BOD, COMPARATOR, DMA(16), PWM(6), RTC, TIMER(7), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

LPC11E68JBD64E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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