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LPC11E68JBD48E

NXP Semiconductors

LPC11E68JBD48E by NXP Semiconductors

NXP Semiconductors' LPC11E68JBD48E is a 32-bit microcontroller with 3.3V supply, 25 MHz clock frequency, and 262144 ROM words. Ideal for industrial applications, it features 10-Ch ADC, 12-Bit resolution, and peripherals like BOD, DMA(16), PWM(6), RTC, TIMER(7), WDT for efficient system integration. With -40 to 105 °C operating temperature range and compact FLATPACK package style (7mm x 7mm), it offers reliable performance in various environments.

Median Price

$4.196

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,035 parts In-Stock

1+ parts

-

100+ parts

$3.730

1k+ parts

$3.340

10k+ parts

$3.140

5,035

-

$3.730

$3.340

$3.140

Verical

USA . 5,035 parts In-Stock

1+ parts

-

100+ parts

$4.662

1k+ parts

$4.175

10k+ parts

$3.925

5,035

-

$4.662

$4.175

$3.925

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 36 parts In-Stock

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$3.115

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36

$3.115

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Vyrian

USA . 6,320 parts In-Stock

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6,320

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Digiode

USA . 2,952 parts In-Stock

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Flip Electronics

USA . 1,000 parts In-Stock

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Anansix

USA . 502 parts In-Stock

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502

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Distributors (Availability)

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Corohmni

South Africa . 350 parts In-Stock

1+ parts

$2.950

100+ parts

-

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350

$2.950

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$3.115

100+ parts

$3.052

1k+ parts

-

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2,000

$3.115

$3.052

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Argo Parts USA

USA . 1,087 parts In-Stock

1+ parts

$3.115

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1,087

$3.115

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Continental Prestige Electronics

USA . 196 parts In-Stock

1+ parts

$4.380

100+ parts

$2.910

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196

$4.380

$2.910

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AZTECH Wire

Italy . 399 parts In-Stock

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$5.046

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Microchip USA

USA . 1,305 parts In-Stock

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$14.862

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Ampacity Inc.

Singapore . 547 parts In-Stock

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$16.000

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Aztec Data Supply Inc.

USA . 204 parts In-Stock

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$24.928

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204

$24.928

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One Stop Electronics

USA . 1,283 parts In-Stock

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$26.000

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Semicontronic

India . 1,629 parts In-Stock

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$35.000

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$34.125

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$33.950

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$34.125

$33.950

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S.R.D Solutions

India . 78,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 19,950 parts In-Stock

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Lixinc

USA . 8,493 parts In-Stock

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Vigor

Singapore . 7,562 parts In-Stock

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UNI Independent Distributors

Spain . 4,679 parts In-Stock

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Corphita

USA . 3,977 parts In-Stock

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Perfect Parts

USA . 560 parts In-Stock

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Overview

Unlock the power of innovation with the LPC11E68JBD48E microcontroller from NXP Semiconductors. This cutting-edge device offers exceptional quality and reliability, making it the perfect choice for a wide range of applications. With advanced features like 32-bit processing, multiple ADC and DMA channels, and a maximum clock frequency of 25 MHz, this microcontroller provides unparalleled performance. Seamlessly integrate connectivity options such as I2C, SSP, and USART to enhance your project's capabilities. Trust NXP Semiconductors to deliver top-notch technology that will take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures the product is robust and long-lasting.

Surface Mount: YES

Allows for easy installation and integration into various electronic devices.

Maximum Supply Voltage: 3.6 V

Provides a wide range of voltage options for flexibility in power supply.

Package Shape: SQUARE

Square shape helps in efficient utilization of space in compact electronic designs.

Bit Size: 32

A larger bit size allows for more complex processing and calculations.

Power Supplies (V): 3.3

Provides a stable power supply for reliable performance.

No. of Terminals: 48

High number of terminals offer versatile connectivity options.

Package Style (Meter): FLATPACK

Flatpack design enhances heat dissipation for better performance.

Minimum Supply Voltage: 2.4 V

Offers a low minimum supply voltage for energy efficiency.

Maximum Operating Temperature: 105 °C

Can withstand high temperatures, suitable for industrial applications.

CPU Family: CORTEX-M0

Belongs to a powerful CPU family known for efficiency and performance.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions.

Terminal Finish: TIN

TIN finish provides corrosion resistance for long-lasting use.

ADC Channels: YES

Integrated ADC channels allow for analog to digital conversion.

DMA Channels: YES

DMA channels enable efficient data transfer without CPU intervention.

Terminal Position: QUAD

Quad terminal position facilitates easy soldering and connectivity.

ROM Words: 262144

Large ROM capacity for storing program data.

Width: 7 mm

Compact width for space-saving integration in electronic devices.

Data EEPROM Size: 4096

Sufficient EEPROM size for storing configuration data.

Peripherals: BOD, COMPARATOR, DMA(16), PWM(6), RTC, TIMER(7), WDT

Wide range of peripherals enhance functionality and versatility.

Maximum Clock Frequency: 25 MHz

High clock frequency for faster processing speed.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for compact layout design.

RAM Bytes: 36864

Large RAM capacity for storing and accessing data during operation.

Technology: CMOS

Utilizes CMOS technology known for low power consumption and high speed.

Terminal Form: GULL WING

Gull wing terminal form provides secure solder connections.

Analog To Digital Convertors: 10-Ch 12-Bit

10-channel 12-bit ADCs for precise analog signal conversion.

Nominal Supply Voltage: 3.3 V

Maintains a stable supply voltage for reliable operation.

PWM Channels: YES

Integrated PWM channels for precise control of output signals.

Connectivity: I2C(2), SSP(2), USART(4)

Various connectivity options for seamless communication with other devices.

ROM Programmability: FLASH

FLASH ROM programmability allows for easy updates and modifications.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, suitable for most environments.

Speed: 50 rpm

Capable of operating at a speed of 50 rotations per minute.

On Chip Program ROM Width: 8

8-bit wide on-chip ROM for program storage.

No. of I/O Lines: 36

Provides a high number of input/output lines for versatile connectivity options.

Technical Specifications

Microcontrollers LPC11E68JBD48E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

36

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

36864

ROM Words:

262144

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

4096

Connectivity:

I2C(2), SSP(2), USART(4)

Peripherals:

BOD, COMPARATOR, DMA(16), PWM(6), RTC, TIMER(7), WDT

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

LPC11E68JBD48E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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