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LPC1114FHN33/303,5

NXP Semiconductors

LPC1114FHN33/303,5 by NXP Semiconductors

NXP Semiconductors' LPC1114FHN33/303,5 is a 32-bit microcontroller with 3.3V supply, 25MHz clock frequency, and 8-Ch 10-Bit ADC channels. Ideal for industrial applications, it features Cortex-M0 CPU family, FLASH ROM programmability, and connectivity via I2C, SPI(2), UART interfaces.

Median Price

$4.220

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,260 parts In-Stock

1+ parts

$4.220

100+ parts

$2.660

1k+ parts

$2.430

10k+ parts

$2.290

1,260

$4.220

$2.660

$2.430

$2.290

DigiKey

USA . 790 parts In-Stock

1+ parts

$4.220

100+ parts

$2.654

1k+ parts

$2.433

10k+ parts

$2.297

790

$4.220

$2.654

$2.433

$2.297

Element14

Singapore . 3 parts In-Stock

1+ parts

$4.240

100+ parts

$3.130

1k+ parts

$2.240

10k+ parts

-

3

$4.240

$3.130

$2.240

-

Verical

USA . 9,880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.087

10k+ parts

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9,880

-

-

$2.087

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Flip Electronics (Authorized)

USA . 471 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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471

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 54 parts In-Stock

1+ parts

$3.104

100+ parts

-

1k+ parts

-

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54

$3.104

-

-

-

Digiode

USA . 1,053 parts In-Stock

1+ parts

$3.506

100+ parts

-

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-

10k+ parts

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1,053

$3.506

-

-

-

Anansix

USA . 1,210 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,210

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Flip Electronics

USA . 471 parts In-Stock

1+ parts

-

100+ parts

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471

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Vyrian

USA . 371 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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371

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$3.042

100+ parts

-

1k+ parts

$2.920

10k+ parts

-

1,000

$3.042

-

$2.920

-

Semicontronic

India . 97 parts In-Stock

1+ parts

$3.100

100+ parts

$3.022

1k+ parts

$3.007

10k+ parts

-

97

$3.100

$3.022

$3.007

-

Ampacity Inc.

Singapore . 5 parts In-Stock

1+ parts

$3.100

100+ parts

-

1k+ parts

-

10k+ parts

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5

$3.100

-

-

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Continental Prestige Electronics

USA . 5,573 parts In-Stock

1+ parts

$3.104

100+ parts

-

1k+ parts

-

10k+ parts

$3.042

5,573

$3.104

-

-

$3.042

Argo Parts USA

USA . 806 parts In-Stock

1+ parts

$3.104

100+ parts

-

1k+ parts

-

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806

$3.104

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Corphita

USA . 261 parts In-Stock

1+ parts

$3.321

100+ parts

-

1k+ parts

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261

$3.321

-

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Component Stockers USA

USA . 2,134 parts In-Stock

1+ parts

$4.420

100+ parts

$2.830

1k+ parts

$2.770

10k+ parts

-

2,134

$4.420

$2.830

$2.770

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AZTECH Wire

Italy . 371 parts In-Stock

1+ parts

$12.200

100+ parts

-

1k+ parts

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371

$12.200

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Corohmni

South Africa . 293 parts In-Stock

1+ parts

$42.042

100+ parts

-

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293

$42.042

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Modulus Dynamics

Lithuania . 2,797 parts In-Stock

1+ parts

$54.113

100+ parts

$54.113

1k+ parts

$54.113

10k+ parts

-

2,797

$54.113

$54.113

$54.113

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UNI Independent Distributors

Spain . 5,406 parts In-Stock

1+ parts

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5,406

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Microchip USA

USA . 4,041 parts In-Stock

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4,041

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1,000

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Overview

Discover the LPC1114FHN33/303,5 by NXP Semiconductors, a high-quality microcontroller that offers unparalleled value and benefits. With its cutting-edge technology and industrial-grade temperature grade, this microcontroller is perfect for a variety of applications. Whether you need connectivity for I2C, SPI, and UART or powerful peripherals like BOD and TIMER, this chip has you covered. Experience the advantages of the LPC1114FHN33/303,5 and unlock endless possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this microcontroller lightweight and durable.

Surface Mount: YES

The surface mount feature allows for easy and secure installation on circuit boards.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle higher power requirements.

Package Shape: SQUARE

The square package shape allows for efficient use of board space in small electronic devices.

Bit Size: 32

The 32-bit architecture offers improved performance and processing capabilities.

Power Supplies (V): 3.3

Operating at a standard supply voltage of 3.3V ensures compatibility with various power sources.

No. of Terminals: 33

The 33 terminals provide ample connectivity options for interfacing with external devices.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier, heat sink/slug, and very thin profile package style allows for efficient heat dissipation and space-saving design.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage of 1.8V conserves power consumption and extends battery life.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance in various environmental conditions.

CPU Family: CORTEX-M0

The Cortex-M0 CPU family offers a balance of performance and energy efficiency for optimal functionality.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature (-40°C) ensures operation even in extreme cold environments.

ADC Channels: YES

The presence of ADC channels enables analog signal conversion for sensing and control applications.

Terminal Position: QUAD

The quad terminal position facilitates easy connections and robust electrical connections.

ROM Words: 32768

The 32KB ROM capacity allows for storing program instructions and data for efficient operation.

Width: 7 mm

The compact width of 7mm makes this microcontroller suitable for space-constrained applications.

Peripherals: BOD, POR, TIMER(5), WDT

The built-in peripherals such as BOD, POR, timers, and watchdog timer enhance the functionality and reliability of the microcontroller.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency of 25MHz enables fast data processing and response times.

Peak Reflow Temperature: 260 C

The high peak reflow temperature of 260°C ensures secure assembly and soldering processes.

Length: 7 mm

The small length of 7mm contributes to a compact form factor for space-saving designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC-based microcontroller design offers efficient execution of instructions and low power consumption.

RAM Bytes: 8192

The 8KB RAM capacity provides temporary memory storage for data manipulation and processing.

Technology: CMOS

The CMOS technology used in this microcontroller offers low power consumption and high noise immunity.

Terminal Form: NO LEAD

The no-lead terminal form simplifies assembly and reduces the risk of lead-related issues.

Analog To Digital Converters: 8-Ch 10-Bit

The 8-channel 10-bit ADC enables the conversion of analog signals into digital data for accurate measurements.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage ensures compatibility with standard power sources.

Connectivity: I2C, SPI(2), UART

The multiple connectivity options including I2C, SPI, and UART support flexible communication with other devices.

ROM Programmability: FLASH

The flash ROM programmability allows for easy and efficient updating of firmware and software.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm enables high-density mounting on PCBs for compact designs.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates the level of moisture resistance, making it suitable for various environments.

Speed: 50 rpm

The speed of 50 rpm provides efficient data processing capabilities for real-time applications.

On Chip Program ROM Width: 8

The 8-bit width of the on-chip program ROM allows for storing and executing instructions efficiently.

No. of I/O Lines: 28

With 28 I/O lines, this microcontroller offers versatile interface options for connecting to external devices.

Technical Specifications

Microcontrollers LPC1114FHN33/303,5 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

33

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BOD, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC1114FHN33/303,5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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