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LPC1114FHN33/201,5

NXP Semiconductors

LPC1114FHN33/201,5 by NXP Semiconductors

LPC1114FHN33/201,5 by NXP is a 32-bit microcontroller featuring a max supply voltage of 3.6V and an operating temp range from -40 °C to 85 °C. It offers 8 ADC channels and supports I2C, SPI, and UART for versatile applications in industrial automation. With 4KB RAM and flash ROM, it's ideal for embedded systems.

Median Price

$2.356

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 40 parts In-Stock

1+ parts

$4.095

100+ parts

$2.611

1k+ parts

$2.291

10k+ parts

$2.235

40

$4.095

$2.611

$2.291

$2.235

Future Electronics

Canada . 1,040 parts In-Stock

1+ parts

-

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$2.100

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1,040

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$2.100

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Rochester

USA . 260 parts In-Stock

1+ parts

-

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$2.100

1k+ parts

$1.880

10k+ parts

$1.770

260

-

$2.100

$1.880

$1.770

Verical

USA . 40 parts In-Stock

1+ parts

-

100+ parts

$2.611

1k+ parts

$2.291

10k+ parts

$2.235

40

-

$2.611

$2.291

$2.235

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,883 parts In-Stock

1+ parts

$3.116

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4,883

$3.116

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Vyrian

USA . 4,196 parts In-Stock

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4,196

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Anansix

USA . 1,328 parts In-Stock

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IBS Electronics

USA . 20 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$2.917

10k+ parts

$2.861

20

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-

$2.917

$2.861

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,146 parts In-Stock

1+ parts

$2.952

100+ parts

-

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2,146

$2.952

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Component Stockers USA

USA . 358 parts In-Stock

1+ parts

$4.530

100+ parts

$3.140

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358

$4.530

$3.140

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AZTECH Wire

Italy . 780 parts In-Stock

1+ parts

$19.930

100+ parts

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780

$19.930

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QUARKTWIN TECHNOLOGY LTD

USA . 22,897 parts In-Stock

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22,897

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Microchip USA

USA . 10,774 parts In-Stock

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UNI Independent Distributors

Spain . 7,574 parts In-Stock

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Perfect Parts

USA . 874 parts In-Stock

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Infinite Electronics LLP (Excess)

. 525 parts In-Stock

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525

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Overview

Unlock limitless possibilities with the LPC1114FHN33/201,5 from NXP Semiconductors, a leader in innovation and quality. This versatile microcontroller combines robust performance with low power consumption, making it ideal for applications in automotive, industrial, and IoT devices. With its compact design and reliable operation across extreme temperatures, you'll benefit from enhanced efficiency and longevity, empowering your projects to excel in every environment. Experience the NXP advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for smaller footprints and easier integration into PCB designs, ideal for compact electronic devices.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, the microcontroller is energy-efficient, suitable for battery-operated applications.

Package Shape: SQUARE

A square package shape aids in efficient space utilization on circuit boards and improves thermal performance.

Bit Size: 32

The 32-bit architecture supports complex computing tasks and enhances performance in applications requiring higher processing power.

Power Supplies (V): 3.3

Designed to operate at 3.3 V, offers compatibility with most modern low-power systems, enhancing system integration.

No. of Terminals: 33

A higher number of terminals (33) allows for greater connectivity and flexibility in interfacing with various peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile and heat sink features facilitate better thermal management and optimize space in compact designs.

Minimum Supply Voltage: 1.8 V

Operating at a minimum supply voltage of 1.8 V enhances flexibility for low-power applications, extending battery life.

Maximum Operating Temperature: 85 °C

An operating temperature up to 85 °C ensures reliable performance in various environments, making it ideal for industrial applications.

CPU Family: CORTEX-M0

The Cortex-M0 core offers a perfect balance of performance and power efficiency, making it suitable for a wide range of embedded applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, it can function effectively in extreme cold environments, ensuring robust reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish ensures excellent conductivity and resistance to corrosion, improving long-term reliability.

ADC Channels: YES

The presence of analog-to-digital conversion channels allows for direct interfacing with sensors, increasing versatility in applications.

Terminal Position: QUAD

Quad terminal positioning facilitates better mechanical stability and electrical contact, optimizing performance in circuit designs.

ROM Words: 32768

With 32,768 ROM words, it provides ample storage for firmware and application code, enhancing programming capabilities.

Width: 7 mm

A compact 7 mm width contributes to a smaller PCB layout, perfect for space-constrained applications.

Peripherals: BOD, POR, TIMER(5), WDT

Incorporating various peripherals like timers and watchdog timers enhances control and monitoring features in embedded systems.

Maximum Clock Frequency: 25 MHz

A maximum clock frequency of 25 MHz allows for high-speed processing, accommodating demanding application requirements.

Maximum Time At Peak Reflow Temperature (s): 30

The capability to withstand up to 30 seconds at peak reflow temperature ensures compatibility with standard soldering processes.

Peak Reflow Temperature °C: 260

At a peak temperature tolerance of 260 °C, the microcontroller is suitable for modern soldering techniques, enhancing manufacturability.

Length: 7 mm

With a length of 7 mm, this microcontroller remains space-efficient, promoting the design of compact electronics.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates robustness and reliability, making it appropriate for harsh operating environments.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC-type microcontroller, it offers efficiency in processing speed and power consumption, maximizing performance in applications.

RAM Bytes: 4096

With 4096 bytes of RAM, it provides sufficient temporary data storage for supporting complex processing tasks.

Technology: CMOS

CMOS technology ensures lower power consumption and higher integration levels, aiding in the development of energy-efficient devices.

Terminal Form: NO LEAD

No-lead terminal form factor provides a compact design while promoting reduced weight and enhanced thermal performance.

Analog To Digital Converters: 8-Ch 10-Bit

The inclusion of 8-channel 10-bit ADCs allows for multi-sensor applications, expanding its utility in various monitoring systems.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V indicates compatibility with widely used digital logic levels, simplifying integration with other components.

Connectivity: I2C, SPI, UART

Supports multiple connectivity options (I2C, SPI, UART), enhancing versatility in interfacing with other devices and communication protocols.

ROM Programmability: FLASH

Flash ROM enables easy reprogramming to update software, allowing for flexible product development and revision.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for high-density PCB layout, accommodating a greater number of connections in a compact area.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, it can withstand standard handling and assembly processes without special precautions.

Speed: 50 rpm

Operating at a speed of 50 rpm indicates suitability for applications that require moderate real-time responsiveness.

On Chip Program ROM Width: 8

An 8-bit program ROM width facilitates efficient data handling and processing within its architecture.

No. of I/O Lines: 28

Having 28 I/O lines enhances the capability for interacting with external devices, accommodating a wide variety of application requirements.

Technical Specifications

Microcontrollers LPC1114FHN33/201,5 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

33

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

32768

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI, UART

Peripherals:

BOD, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC1114FHN33/201,5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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