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LPC1113FHN33/202,5

NXP Semiconductors

LPC1113FHN33/202,5 by NXP Semiconductors

NXP Semiconductors' LPC1113FHN33/202,5 is a 32-bit microcontroller with 3.3V supply voltage, 25 MHz clock frequency, and 4096 bytes of RAM. Ideal for industrial applications requiring a compact chip carrier package with I2C, SPI, and UART connectivity options.

Median Price

$1.880

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 8,595 parts In-Stock

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$1.550

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8,595

$1.550

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Chip1Stop

Japan . 8,595 parts In-Stock

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$4.310

100+ parts

$3.810

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8,595

$4.310

$3.810

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Flip Electronics (Authorized)

USA . 1,569 parts In-Stock

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1,569

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Rochester

USA . 1,140 parts In-Stock

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$1.880

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$1.680

10k+ parts

$1.580

1,140

-

$1.880

$1.680

$1.580

Distributors (In-Stock)

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Digiode

USA . 1,414 parts In-Stock

1+ parts

$1.644

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1,414

$1.644

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Vyrian

USA . 11,093 parts In-Stock

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Flip Electronics

USA . 4,689 parts In-Stock

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Anansix

USA . 2,734 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Ampacity Inc.

Singapore . 9,420 parts In-Stock

1+ parts

$1.470

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9,420

$1.470

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Corphita

USA . 4,963 parts In-Stock

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$1.557

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4,963

$1.557

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Component Stockers USA

USA . 24,119 parts In-Stock

1+ parts

$2.440

100+ parts

$1.690

1k+ parts

$1.580

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24,119

$2.440

$1.690

$1.580

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Semicontronic

India . 4,856 parts In-Stock

1+ parts

$3.200

100+ parts

$3.120

1k+ parts

$3.104

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4,856

$3.200

$3.120

$3.104

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Corohmni

South Africa . 446 parts In-Stock

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$47.232

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446

$47.232

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Advanced Electronics

New Zealand . 32 parts In-Stock

1+ parts

$64.210

100+ parts

$58.431

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$52.652

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32

$64.210

$58.431

$52.652

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Aztec Data Supply Inc.

USA . 1,239 parts In-Stock

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$76.806

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1,239

$76.806

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UNI Independent Distributors

Spain . 8,078 parts In-Stock

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Microchip USA

USA . 6,668 parts In-Stock

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Argo Parts USA

USA . 1,061 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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800

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Continental Prestige Electronics

USA . 113 parts In-Stock

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Overview

Discover the LPC1113FHN33/202,5 by NXP Semiconductors, a top-tier microcontroller designed to take your projects to new heights. With cutting-edge technology and unparalleled reliability, NXP Semiconductors ensures optimal performance in a wide range of applications. From industrial automation to consumer electronics, this microcontroller offers seamless connectivity, high-speed processing, and efficient power management. Elevate your designs with the LPC1113FHN33/202,5 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving space and enabling automated assembly.

Maximum Supply Voltage: 3.6 V

Supports a wide range of power supply options and ensures compatibility with different systems.

Package Shape: SQUARE

Facilitates compact and efficient design layouts, optimizing space on the circuit board.

Bit Size: 32

Offers high computational power and efficiency for processing complex tasks and data.

Power Supplies (V): 3.3

Operates at a standard voltage level, making it compatible with common power sources.

No. of Terminals: 33

Provides ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers multiple package styles for different application needs, enhancing versatility.

Minimum Supply Voltage: 1.8 V

Supports lower power operation and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in harsh environmental conditions with high temperatures.

CPU Family: CORTEX-M0

Belongs to a well-known and efficient processor family, ensuring smooth operation and compatibility.

Minimum Operating Temperature: -40 °C

Allows for operation in extreme cold environments without compromising performance.

ADC Channels: YES

Includes analog-to-digital converters for capturing and processing analog signals, expanding functionality.

Terminal Position: QUAD

Organizes terminals in a convenient layout for easy connection and integration within the system.

ROM Words: 24576

Provides sufficient memory for storing program instructions and data, supporting complex applications.

Width: 7 mm

Compact size enables space-efficient designs, particularly important in small electronic devices.

Peripherals: BOD, POR, TIMER(5), WDT

Includes essential peripherals such as Brown-out Detector, Power-on Reset, Timers, and Watchdog Timer for enhanced functionality and reliability.

Maximum Clock Frequency: 25 MHz

Offers high-speed processing capabilities for handling demanding tasks and real-time operations.

Peak Reflow Temperature °C: 260

Withstands high-temperature reflow processes during manufacturing, ensuring robust assembly.

Length: 7 mm

Compact size complements the width dimension for overall miniaturization and space optimization.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with varying temperature conditions and stability requirements.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture, known for its efficiency and performance in embedded applications.

RAM Bytes: 4096

Offers sufficient random-access memory for data storage and processing, supporting multitasking and efficient operation.

Technology: CMOS

Utilizes CMOS technology for low power consumption, reducing energy usage and heat generation.

Terminal Form: NO LEAD

Features lead-free terminals for environmentally friendly and RoHS-compliant manufacturing.

Analog To Digital Convertors: 8-Ch 10-Bit

Includes multiple ADC channels with 10-bit resolution for accurate analog signal conversion and processing.

Nominal Supply Voltage: 3.3 V

Operates at a stable voltage level, ensuring consistent performance and compatibility with standard power sources.

Connectivity: I2C, SPI, UART

Supports various communication protocols like I2C, SPI, and UART, enabling seamless connectivity with external devices.

ROM Programmability: FLASH

Utilizes flash memory for programmability, allowing for easy and quick updates to firmware and software.

Terminal Pitch: 0.65 mm

Provides a fine terminal pitch for high-density integration, supporting miniaturization and compact designs.

Moisture Sensitivity Level (MSL): 3

Complies with industry standards for moisture sensitivity, ensuring reliability during handling and storage.

Speed: 50 rpm

Indicates the rotational speed of a component, which may be relevant for specific mechanical applications.

On Chip Program ROM Width: 8

Offers a wide program ROM width for storing instructions, supporting versatile software applications.

No. of I/O Lines: 28

Provides a sufficient number of input/output lines for interfacing with external devices and peripherals, enhancing connectivity.

Technical Specifications

Microcontrollers LPC1113FHN33/202,5 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

33

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

24576

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI, UART

Peripherals:

BOD, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC1113FHN33/202,5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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