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LPC1113FBD48/302,1

NXP Semiconductors

LPC1113FBD48/302,1 by NXP Semiconductors

LPC1113FBD48/302,1 by NXP is a 32-bit microcontroller featuring a max supply voltage of 3.6V and operates in -40 °C to 85 °C range. It includes 8 ADC channels and supports I2C, SPI, and UART for versatile applications in industrial automation. With 8KB RAM and flash ROM, it's ideal for embedded systems.

Median Price

$2.210

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 26 parts In-Stock

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-

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$2.210

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$1.980

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$1.860

26

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$1.980

$1.860

Distributors (In-Stock)

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Digiode

USA . 1,149 parts In-Stock

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$1.928

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$1.928

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J2 Sourcing AB

Sweden . 32,953 parts In-Stock

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Vyrian

USA . 9,437 parts In-Stock

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Flip Electronics

USA . 4,000 parts In-Stock

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Anansix

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Semi Source

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Prism Electronics

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Distributors (Availability)

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Corphita

USA . 1,584 parts In-Stock

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$1.827

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$1.827

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Vigor

Singapore . 88 parts In-Stock

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$2.780

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AZTECH Wire

Italy . 521 parts In-Stock

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$12.650

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QUARKTWIN TECHNOLOGY LTD

USA . 18,768 parts In-Stock

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Authorized Procurement Solutions

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UNI Independent Distributors

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Microchip USA

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Overview

Unlock the future of innovation with the LPC1113FBD48/302,1 microcontroller from NXP Semiconductors. Renowned for its superior quality and reliability, this 32-bit powerhouse offers exceptional performance in diverse applications, from industrial automation to consumer electronics. Experience seamless integration, low power consumption, and robust connectivity options, empowering you to design smarter, more efficient solutions that stand out in today's competitive landscape. Choose excellence; choose NXP!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction ensures reliability and resilience in various operating environments.

Surface Mount: YES

This feature facilitates compact design and easy integration into modern electronics.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V allows for compatibility with a wide range of power supplies in portable applications.

Package Shape: SQUARE

The square package shape optimizes space efficiency on printed circuit boards (PCBs).

Bit Size: 32

A 32-bit architecture enhances computational performance for complex applications.

Power Supplies (V): 3.3

Operating at 3.3 V is ideal for low-power applications, making it energy efficient.

No. of Terminals: 48

The 48 terminals provide ample I/O options for connecting various peripherals.

Package Style (Meter): FLATPACK

The flatpack style aids in better thermal dissipation and electrical performance.

Minimum Supply Voltage: 1.8 V

A low minimum supply voltage allows operation in battery-powered applications and extends battery life.

Maximum Operating Temperature: 85 °C

This temperature rating ensures reliable operation in moderately high-temperature environments.

CPU Family: CORTEX-M0

Based on the efficient ARM Cortex-M0, it offers excellent performance for low-power embedded applications.

Minimum Operating Temperature: -40 °C

The ability to function at -40 °C makes this microcontroller suitable for harsh conditions.

Terminal Finish: TIN

The tin finish provides good solderability and enhances connection reliability.

ADC Channels: YES

Integrated ADC channels enable easy integration of analog inputs, important for sensor applications.

Terminal Position: QUAD

Quad terminal positioning enhances mounting stability and provides ease of assembly.

ROM Words: 24576

With 24,576 ROM words, it offers substantial program storage for advanced applications.

Width: 7 mm

The compact width is advantageous in space-constrained designs.

Peripherals: BOD, POR, TIMER(5), WDT

The diverse peripherals enhance functionality, enabling more complex operations and monitoring.

Maximum Clock Frequency: 25 MHz

A 25 MHz clock frequency ensures fast processing for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand up to 30 seconds at peak reflow temperature enables compatibility with standard assembly processes.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates robustness against high-temperature soldering conditions.

Length: 7 mm

The compact length allows for dense circuitry in modern electronics.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates reliability in temperature-sensitive environments.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it benefits from a simple instruction set for efficient processing.

RAM Bytes: 8192

With 8 KB of RAM, it allows for effective handling of data-intensive applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity.

Terminal Form: GULL WING

The gull wing terminal form promotes reliable connections and facilitates automated assembly.

Analog To Digital Converters: 8-Ch 10-Bit

Having 8 channels of 10-bit ADCs allows for versatile analog data measurement, suitable for various applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V optimizes performance while maintaining energy efficiency.

Connectivity: I2C, SPI(2), UART

Multiple connectivity options including I2C, SPI, and UART facilitate easy integration with other devices.

ROM Programmability: FLASH

Flash programmability allows for easy updates and reprogramming of the applications.

Terminal Pitch: 0.5 mm

A fine terminal pitch of 0.5 mm allows for high-density PCB layout.

Speed: 50 rpm

The operational speed supports applications requiring precise control and responsiveness.

On Chip Program ROM Width: 8

The 8-bit ROM width provides standard data width for programming tasks, enhancing device compatibility.

No. of I/O Lines: 42

Having 42 I/O lines enables extensive interfacing flexibility with peripherals and sensors.

Technical Specifications

Microcontrollers LPC1113FBD48/302,1 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

42

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

24576

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BOD, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC1113FBD48/302,1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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