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LPC1111FHN33/103,5

NXP Semiconductors

LPC1111FHN33/103,5 by NXP Semiconductors

LPC1111FHN33/103,5 by NXP is a 32-bit microcontroller featuring a max supply voltage of 3.6V and operates in -40 °C to 85 °C range. It includes 8 ADC channels and supports I2C, SPI, and UART for versatile connectivity. Ideal for industrial applications requiring compact design and efficient performance.

Median Price

$1.330

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 210 parts In-Stock

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$1.330

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$1.300

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$1.280

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210

$1.330

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$1.280

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Distributors (In-Stock)

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Digiode

USA . 3,627 parts In-Stock

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Vyrian

USA . 2,831 parts In-Stock

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Anansix

USA . 579 parts In-Stock

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579

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Vigor

Singapore . 210 parts In-Stock

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$1.010

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210

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AZTECH Wire

Italy . 731 parts In-Stock

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$14.670

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731

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One Stop Electronics

USA . 327 parts In-Stock

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$20.000

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QUARKTWIN TECHNOLOGY LTD

USA . 15,493 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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UNI Independent Distributors

Spain . 6,646 parts In-Stock

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Microchip USA

USA . 4,108 parts In-Stock

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Corphita

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Overview

Unlock innovation with the LPC1111FHN33/103,5 microcontroller from NXP Semiconductors. Renowned for their quality and reliability, NXP delivers a versatile 32-bit solution tailored for diverse applications—from industrial automation to consumer electronics. Experience enhanced performance, low power consumption, and robust connectivity options that simplify your design process. Elevate your projects with a product that's engineered to exceed expectations!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easier integration into modern electronic designs, saving space and facilitating automated assembly.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V is compatible with most low-power applications, making it efficient in power management.

Package Shape: SQUARE

The square package shape enables efficient use of PCB space and simplifies layout considerations in compact designs.

Bit Size: 32

A 32-bit architecture provides the capability to handle larger data and execute more complex operations, enhancing performance.

Power Supplies (V): 3.3

Operating at a nominal supply voltage of 3.3 V is common in contemporary digital circuits, ensuring broad compatibility.

No. of Terminals: 33

With 33 terminals, the microcontroller offers adequate I/O capabilities for interfacing with multiple devices and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile package style is beneficial for applications requiring compact designs without compromising performance.

Minimum Supply Voltage: 1.8 V

Supporting a low minimum supply voltage of 1.8 V makes it energy-efficient and suitable for battery-operated devices.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures reliability in various industrial environments where heat could be a factor.

CPU Family: CORTEX-M0

Based on the efficient CORTEX-M0 architecture, this microcontroller provides low power consumption and high performance.

Minimum Operating Temperature: -40 °C

Its operation in low temperatures down to -40 °C makes it ideal for use in a wide range of applications, including outdoor or harsh environments.

ADC Channels: YES

The presence of ADC channels allows for versatile sensor interfacing, making this microcontroller suitable for various data acquisition tasks.

Terminal Position: QUAD

Quad terminal positioning enhances connectivity options for seamless integration with circuit boards.

ROM Words: 8192

With 8192 ROM words available for programming, developers can implement extensive functionalities within their applications.

Width: 7 mm

The compact width of 7 mm is suitable for space-constrained applications, promoting design efficiency.

Peripherals: BOD, POR, TIMER(5), WDT

Integrated peripherals such as Timer, Watchdog Timer, and Brown-Out Detector enhance the reliability and control features of the microcontroller.

Maximum Clock Frequency: 25 MHz

A maximum clock frequency of 25 MHz provides adequate performance for many applications, ensuring efficient data processing.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C indicates compatibility with standard soldering processes for flexible assembly methods.

Length: 7 mm

The 7 mm length further contributes to its compact design, making it ideal for tight spaces in electronic systems.

Temperature Grade: INDUSTRIAL

This product's industrial temperature rating ensures reliability in various challenging environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller optimizes its efficiency in executing instructions, leading to better performance in various applications.

RAM Bytes: 2048

2048 bytes of RAM enable the storage of temporary data, facilitating efficient program execution and multi-tasking capabilities.

Technology: CMOS

The use of CMOS technology allows for low power consumption and high noise immunity, enhancing overall functionality.

Terminal Form: NO LEAD

The no lead terminal form factor promotes a reduction in PCB footprint and simplifies the design process.

Analog To Digital Convertors: 8-Ch 10-Bit

The 8-channel 10-bit ADC allows for high-resolution data capture, essential for applications needing precision in measurements.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V optimizes power efficiency and is widely supported in modern electronics.

Connectivity: I2C, SPI(2), UART

Various connectivity options like I2C, SPI, and UART facilitate easy communication with other devices and sensors, enhancing versatility.

ROM Programmability: FLASH

The FLASH ROM programmability provides flexibility for developers to update or modify applications as needed.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch is suited for high-density PCB layouts, accommodating modern design requirements.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 ensures suitable handling and storage, which is crucial for maintaining performance during manufacturing.

Speed: 50 rpm

A speed of 50 rpm is adequate for typical applications, ensuring responsiveness and efficiency in various tasks.

On Chip Program ROM Width: 8

With an 8-bit program ROM width, this microcontroller is efficient in data handling, making it a strong contender for various applications.

No. of I/O Lines: 28

Having 28 I/O lines supports extensive interfacing possibilities, enabling interaction with numerous devices and sensors.

Technical Specifications

Microcontrollers LPC1111FHN33/103,5 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

33

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

8192

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BOD, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC1111FHN33/103,5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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