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CBT3257ADB,118

NXP Semiconductors

CBT3257ADB,118 by NXP Semiconductors

MULTIPLEXER AND DEMUX/DECODER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR;

Median Price

$0.519

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 32,000 parts In-Stock

1+ parts

-

100+ parts

$0.500

1k+ parts

$0.415

10k+ parts

$0.370

32,000

-

$0.500

$0.415

$0.370

Verical

USA . 30,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.519

10k+ parts

$0.463

30,000

-

-

$0.519

$0.463

DigiKey

USA . 2,060 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.630

10k+ parts

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2,060

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$0.630

-

Distributors (In-Stock)

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Digiode

USA . 2,424 parts In-Stock

1+ parts

$0.200

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2,424

$0.200

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Chip Stock

USA . 134,000 parts In-Stock

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Vyrian

USA . 3,905 parts In-Stock

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3,905

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DigiKey Marketplace

USA . 2,060 parts In-Stock

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$0.220

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2,060

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$0.220

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Anansix

USA . 193 parts In-Stock

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193

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Distributors (Availability)

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Corphita

USA . 2,686 parts In-Stock

1+ parts

$0.190

100+ parts

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2,686

$0.190

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Component Stockers USA

USA . 3,414 parts In-Stock

1+ parts

$0.210

100+ parts

$0.200

1k+ parts

$0.180

10k+ parts

$0.180

3,414

$0.210

$0.200

$0.180

$0.180

AZTECH Wire

Italy . 5,021 parts In-Stock

1+ parts

$0.270

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5,021

$0.270

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Continental Prestige Electronics

USA . 32,000 parts In-Stock

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$0.239

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32,000

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$0.239

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QUARKTWIN TECHNOLOGY LTD

USA . 24,732 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Microchip USA

USA . 3,970 parts In-Stock

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Northwest PG Solutions

USA . 3,318 parts In-Stock

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3,318

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UNI Independent Distributors

Spain . 3,153 parts In-Stock

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Supply Digital

USA . 1,999 parts In-Stock

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Native Components

USA . 737 parts In-Stock

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737

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Technical Specifications

Multiplexer & Demultiplexer CBT3257ADB,118 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

Family:

3257

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

6.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

1

No. of Outputs:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

CBT3257ADB,118 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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