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CBT3257ABQ

NXP Semiconductors

CBT3257ABQ by NXP Semiconductors

MULTIPLEXER AND DEMUX/DECODER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: RECTANGULAR;

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 57,000 parts In-Stock

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Vyrian

USA . 5,673 parts In-Stock

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Anansix

USA . 2,462 parts In-Stock

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Digiode

USA . 1,928 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,647 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 9,439 parts In-Stock

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$2.900

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Native Components

USA . 1,025 parts In-Stock

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$8.903

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Northwest PG Solutions

USA . 2,265 parts In-Stock

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$9.793

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$8.813

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One Stop Electronics

USA . 1,500 parts In-Stock

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$29.000

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A-Z Elektronik GmbH

Germany . 13,361 parts In-Stock

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Authorized Procurement Solutions

USA . 9,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,574 parts In-Stock

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UNI Independent Distributors

Spain . 3,985 parts In-Stock

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Perfect Parts

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Corphita

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Kepictronics

USA . 3,351 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1,647 parts In-Stock

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Metaverse IC Inc.

Canada . 1,496 parts In-Stock

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Supply Digital

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Glotronic Ltd.

UK . 1,318 parts In-Stock

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Technical Specifications

Multiplexer & Demultiplexer CBT3257ABQ attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

Family:

3257

JESD-30 Code:

R-PQCC-N16

JESD-609 Code:

e4

Length:

3.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

1

No. of Outputs:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.5 mm

Trade Compliance

CBT3257ABQ Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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