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BZV90C12

NXP Semiconductors

BZV90C12 by NXP Semiconductors

BZV90C12 by NXP Semiconductors is a unidirectional Zener diode with a nominal voltage of 12 V and max power dissipation of 1.5 W. It features a small outline package, ideal for surface mount applications. With a max operating temp of 150 °C, it ensures reliable performance in various circuits.

Median Price

$0.140

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Tomark Electronics Ltd

UK . 556 parts In-Stock

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Vyrian

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Digiode

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Halfin

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AZTECH Wire

Italy . 13,140 parts In-Stock

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One Stop Electronics

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Native Components

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Northwest PG Solutions

USA . 3,146 parts In-Stock

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UNI Independent Distributors

Spain . 6,160 parts In-Stock

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Authorized Procurement Solutions

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Corphita

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Supply Digital

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

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Overview

Elevate your designs with the BZV90C12 Zener Diode from NXP Semiconductors, a trusted leader in innovative semiconductor solutions. Crafted for reliability and performance, this compact diode ensures stable voltage regulation across various applications, from consumer electronics to automotive systems. Experience enhanced efficiency and durability, backed by NXP's commitment to quality, making it the ideal choice for engineers seeking dependable components that drive success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy packaging provides durability and resistance to environmental factors, ensuring reliability in various applications.

Config: SINGLE

Single configuration simplifies design and integration into circuits, making it easier for engineers to implement.

Working Test Current: 5 mA

A working test current of 5 mA is suitable for most low-power applications, ensuring efficient performance without excessive power consumption.

Surface Mount: YES

Being a surface-mount component allows for reduced board space and easier assembly in modern electronic designs.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy placement on circuit boards for optimal layouts.

No. of Terminals: 4

With 4 terminals, this Zener diode can provide stable connections and versatile circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for space-efficient designs, making it suitable for compact electronics.

Maximum Voltage Tolerance: 5 %

A maximum voltage tolerance of 5% ensures reliability and precision in voltage regulation applications.

Maximum Operating Temperature: 150 °C

The ability to operate at high temperatures makes this diode suitable for applications in harsh conditions.

Maximum Dynamic Impedance: 25 ohm

With low dynamic impedance, this diode ensures efficient voltage clamping and regulation in dynamic loads.

Terminal Finish: TIN

Tin terminal finish provides good solderability and enhances the longevity of the connections on the PCB.

Terminal Position: DUAL

Dual terminal positioning allows flexible placement within circuits, accommodating various design needs.

Case Connection: CATHODE

Cathode-case connection enhances stability and maintains circuit integrity in Zener applications.

Maximum Power Dissipation: 1.5 W

A maximum power dissipation of 1.5 W provides sufficient headroom for managing heat without compromising performance.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum reflow temperature time of 30 seconds aligns with industry standards, preventing damage during manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures compatibility with modern soldering techniques, essential for efficient assembly.

Diode Type: ZENER DIODE

As a Zener diode, this component is specifically designed for voltage regulation, making it ideal for precision applications.

Maximum Voltage Temperature Coefficient: 10mv/°C

The low voltage temperature coefficient results in minimal variation in output voltage with temperature changes, enhancing reliability.

Nominal Reference Voltage: 12 V

A nominal reference voltage of 12 V is ideal for a variety of voltage regulation applications and standard circuit designs.

Technology: ZENER

Using advanced Zener technology ensures effective and stable voltage regulation, making it suitable for sensitive electronics.

Terminal Form: GULL WING

Gull wing terminals allow for easier soldering and better mechanical stability once mounted on the circuit board.

Polarity: UNIDIRECTIONAL

Unidirectional polarity is essential for preventing reverse current flow, protecting the circuit from damage.

Diode Element Material: SILICON

Silicon as a diode element material offers excellent electrical characteristics, contributing to reliable performance in various applications.

Technical Specifications

Zener Diodes BZV90C12 attributes and parameters. Explore more Zener Diodes devices from NXP Semiconductors

Specs

Case Connection:

CATHODE

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Dynamic Impedance:

25 ohm

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

1.5 W

Qualification:

Not Qualified

Nominal Reference Voltage:

12 V

Sub-Category:

Voltage Reference Diodes

Surface Mount:

YES

Technology:

ZENER

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Temperature Coefficient:

10 mV/Cel

Maximum Voltage Tolerance:

5 %

Working Test Current:

5 mA

Trade Compliance

BZV90C12 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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