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BZV90-C10135

NXP Semiconductors

BZV90-C10135 by NXP Semiconductors

BZV90-C10135 by NXP Semiconductors is a unidirectional Zener diode with a nominal reference voltage of 10 V and max power dissipation of 1.5 W. It features a small outline package, ideal for surface mount applications. With a max operating temp of 150 °C, it ensures reliability in various electronic circuits.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 4,759 parts In-Stock

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4,759

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Digiode

USA . 3,859 parts In-Stock

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Anansix

USA . 1,880 parts In-Stock

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1,880

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Native Components

USA . 109 parts In-Stock

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$1.820

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Northwest PG Solutions

USA . 48 parts In-Stock

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$2.002

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One Stop Electronics

USA . 1,611 parts In-Stock

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$2.010

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UNI Independent Distributors

Spain . 7,333 parts In-Stock

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Corphita

USA . 422 parts In-Stock

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Overview

Elevate your designs with the BZV90-C10135 Zener diode from NXP Semiconductors, a trusted leader in innovation and quality. This robust component offers exceptional voltage regulation and thermal stability, making it ideal for applications in power supplies, signal processing, and more. With its compact surface mount design and high reliability, this diode not only enhances performance but also streamlines assembly, delivering unmatched value for engineers and manufacturers alike.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides excellent protection against environmental factors, ensuring long-term reliability.

Config: SINGLE

A single configuration simplifies circuit design and reduces space requirements on the PCB, making it user-friendly and efficient.

Working Test Current: 5 mA

Optimized working current allows for effective performance in a variety of applications, making it suitable for low-power circuit designs.

Surface Mount: YES

Surface mount compatibility enhances installation flexibility and supports high-density board layouts.

Maximum Reverse Current: 0.2 uA

Low reverse current minimizes power loss and ensures better efficiency in Zener diode applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easier integration into circuit designs, ensuring optimal space utilization on the PCB.

No. of Terminals: 4

Four terminals provide enhanced connectivity options and facilitate versatile circuit arrangements.

Package Style (Meter): SMALL OUTLINE

Small outline package encourages compact design, making it ideal for space-constrained applications.

Maximum Voltage Tolerance: 5%

With a 5% tolerance, it ensures reliable voltage regulation, providing good precision for various applications.

Maximum Operating Temperature: 150 °C

This high operating temperature makes it suitable for use in demanding environments, ensuring stability and performance under stress.

Terminal Finish: TIN

Tin-coated terminals offer excellent solderability and corrosion resistance, ensuring a reliable connection over time.

Terminal Position: DUAL

Dual terminal position enables flexible layout designs, enhancing compatibility with various PCB configurations.

Case Connection: CATHODE

Cathode case connection helps in easy integration and ensures proper orientation in circuits.

Maximum Power Dissipation: 1.5 W

A maximum power dissipation of 1.5 W allows it to handle more demanding applications without overheating.

Diode Type: ZENER DIODE

As a Zener diode, it provides regulated voltage, making it an ideal choice for voltage stabilization in electronic circuits.

Maximum Voltage Temperature Coefficient: 8 mV/°C

A low temperature coefficient ensures that the Zener voltage remains stable across varying temperatures, providing reliable performance.

Nominal Reference Voltage: 10 V

A nominal reference voltage of 10 V is suitable for multiple applications, ensuring versatility in circuit design.

Technology: ZENER

Utilizing Zener technology, it excels at maintaining a constant voltage across a wide range of operating conditions.

Terminal Form: GULL WING

Gull wing terminals facilitate automated assembly processes and provide strong mechanical stability.

Polarity: UNIDIRECTIONAL

Unidirectional design simplifies circuit integration and enhances overall performance in designated applications.

Diode Element Material: SILICON

Silicon material ensures high efficiency and performance, making it a standard choice for diodes in various electronic applications.

Technical Specifications

Zener Diodes BZV90-C10135 attributes and parameters. Explore more Zener Diodes devices from NXP Semiconductors

Specs

Case Connection:

CATHODE

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

1.5 W

Qualification:

Not Qualified

Nominal Reference Voltage:

10 V

Maximum Reverse Current:

.2 uA

Surface Mount:

YES

Technology:

ZENER

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

Maximum Voltage Temperature Coefficient:

8 mV/Cel

Maximum Voltage Tolerance:

5 %

Working Test Current:

5 mA

Trade Compliance

BZV90-C10135 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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