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BSP89-TAPE-13

NXP Semiconductors

BSP89-TAPE-13 by NXP Semiconductors

BSP89-TAPE-13 by NXP Semiconductors is an N-channel power FET designed for efficient switching applications. It features a max DS breakdown voltage of 240V, a pulsed drain current of 1.4A, and operates at up to 150 °C. Its compact surface mount design ensures versatility in various electronic circuits.

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1k+

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Vyrian

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Digiode

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Anansix

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One Stop Electronics

USA . 1,567 parts In-Stock

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Corphita

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Northwest PG Solutions

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Native Components

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Overview

Elevate your designs with the BSP89-TAPE-13 from NXP Semiconductors, a premier name in power solutions. This N-channel FET excels in efficiency and reliability, making it ideal for innovative switching applications. Its compact design ensures seamless integration into your projects while offering superior performance under demanding conditions. Experience enhanced durability and responsiveness that drive your success—choose the BSP89-TAPE-13 for unmatched quality and value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and durability, making the FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

The N-channel configuration is known for high efficiency and better performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances circuit protection, making it advantageous for various switching uses.

Transistor Application: SWITCHING

Optimized for switching applications, providing fast response times and reliable operation.

Surface Mount: YES

The surface mount capability allows for compact designs and automated assembly processes.

Minimum DS Breakdown Voltage: 240 V

A high breakdown voltage ensures the FET can handle high voltage applications, enhancing its versatility.

Package Shape: RECTANGULAR

The rectangular shape can facilitate efficient layout designs on PCBs.

Terminal Form: GULL WING

Gull wing terminals improve solder joint reliability and ease of assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for low power consumption during idle states.

Maximum Pulsed Drain Current (IDM): 1.4 A

The ability to handle higher pulsed currents makes this FET suitable for demanding applications.

No. of Terminals: 4

A 4-terminal design simplifies connections and integration into circuit boards.

Package Style (Meter): SMALL OUTLINE

The small outline package is ideal for space-constrained applications, enhancing design flexibility.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and rapid switching capabilities.

Maximum Operating Temperature: 150 °C

High temperature tolerance expands the range of applications in harsh environments.

Transistor Element Material: SILICON

Silicon provides reliable performance and efficiency in a wide range of electric conditions.

Maximum Turn On Time (ton): 10 ns

Rapid turn-on time enables high-speed switching applications.

Maximum Turn Off Time (toff): 30 ns

Fast turn-off time increases operational efficiency in dynamic applications.

Maximum Drain Current (ID): 0.35 A

A respectable drain current capability makes it suitable for various low to mid power switching applications.

Maximum Drain-Source On Resistance: 10 ohm

Low on-resistance minimizes power loss during operation, enhancing overall efficiency.

Terminal Position: DUAL

Dual terminal positioning aids in versatile network configurations and designs.

Case Connection: DRAIN

DRAIN connection configuration simplifies circuit design for drain-source circuitry.

Maximum Feedback Capacitance (Crss): 9 pF

Low feedback capacitance helps maintain signal integrity and improves frequency response.

Technical Specifications

Power Field Effect Transistors (FET) BSP89-TAPE-13 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

240 V

Maximum Drain Current (ID):

.35 A

Maximum Drain-Source On Resistance:

10 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

9 pF

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

1.4 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

30 ns

Maximum Turn On Time (ton):

10 ns

Trade Compliance

BSP89-TAPE-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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