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BSP89L6327

Infineon Technologies

BSP89L6327 by Infineon Technologies

Infineon's BSP89L6327 is a N-CHANNEL FET with 240V DS breakdown voltage, ideal for power applications. Featuring single configuration with built-in diode, it offers 1.4A max pulsed drain current and 6 ohm max drain-source resistance. Its small outline package and high operating temperature make it suitable for various electronic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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VNN

France . 3,364 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,995 parts In-Stock

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J2 Sourcing AB

Sweden . 1,650 parts In-Stock

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Ack Elektronik San.Tic.Ltd.Sti

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Digiode

USA . 296 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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Vyrian

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 4,777 parts In-Stock

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$0.780

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$0.780

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Modulus Dynamics

Lithuania . 7,178 parts In-Stock

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$1.592

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$1.528

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$1.465

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$1.465

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Corohmni

South Africa . 210 parts In-Stock

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$1.744

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Ampacity Inc.

Singapore . 854 parts In-Stock

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$4.050

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854

$4.050

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AZTECH Wire

Italy . 254 parts In-Stock

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$11.347

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Andel Nordic

Denmark . 600 parts In-Stock

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$25.970

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$18.179

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$18.179

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Semicontronic

India . 1,540 parts In-Stock

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$58.050

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$56.599

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$56.308

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Kepictronics

USA . 22,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 8,081 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,187 parts In-Stock

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Continental Prestige Electronics

USA . 2,322 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Argo Parts USA

USA . 398 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 86 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the BSP89L6327 by Infineon Technologies. This N-CHANNEL Power Field Effect Transistor (FET) is designed with precision and quality in mind, offering customers unmatched performance and reliability. Whether you're looking to enhance your electronic devices or improve power management systems, this single configuration transistor with a built-in diode is the perfect solution. Trust Infineon Technologies to deliver top-notch products that exceed expectations and elevate your projects to the next level. Upgrade your technology game today with the BSP89L6327.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and thermal stability, ensuring the product can withstand various operating conditions.

Polarity or Channel Type: N-CHANNEL

Good choice for use in high-frequency applications due to faster switching speeds and lower conduction losses.

Configuration: SINGLE WITH BUILT-IN DIODE

Convenient design with an integrated diode for reverse current protection, reducing the need for additional components.

Surface Mount: YES

Enables easy installation on PCBs, saving space and facilitating automated assembly processes.

Minimum DS Breakdown Voltage: 240 V

Suitable for applications requiring high voltage tolerance, providing a reliable performance under challenging conditions.

Package Shape: RECTANGULAR

Efficient use of space within electronic systems, allowing for a compact design.

Operating Mode: ENHANCEMENT MODE

Offers better control over the transistor's conductivity, leading to improved efficiency in power management.

Maximum Pulsed Drain Current (IDM): 1.4 A

Ability to handle short-duration high current pulses, suitable for applications requiring power amplification.

Maximum Drain Current (Abs) (ID): 0.35 A

Sustainable current handling capacity for continuous operation, ensuring reliable performance.

No. of Terminals: 4

Simple connectivity for basic circuit configurations, offering ease of integration.

Maximum Power Dissipation (Abs): 1.8 W

Efficient heat dissipation capabilities, enabling sustained operation without overheating.

Package Style (Meter): SMALL OUTLINE

Space-efficient form factor for compact electronic devices or densely populated circuits.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Reliable and efficient transistor design for various electronic applications, ensuring consistent performance.

Maximum Operating Temperature: 150 °C

Wide temperature range support for versatile use in different environments, enhancing product flexibility.

Transistor Element Material: SILICON

Common and reliable material choice for transistors, ensuring stability and long-term performance.

Terminal Finish: Matte Tin (Sn)

Corrosion-resistant finish for improved longevity and reliability in various operating conditions.

Maximum Drain-Source On Resistance: 6 ohm

Low on-resistance for minimal power loss and efficient circuit operation.

Terminal Position: DUAL

Provides flexibility in circuit design and connection options, accommodating various system requirements.

Case Connection: DRAIN

Specific terminal connection for efficient current flow management, ensuring optimal performance.

Maximum Time At Peak Reflow Temperature (s): 40

Allows for safe and effective reflow soldering processes without compromising component integrity.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance for reliable soldering operations, ensuring secure component attachment.

Technical Specifications

Power Field Effect Transistors (FET) BSP89L6327 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

240 V

Maximum Drain Current (Abs) (ID):

.35 A

Maximum Drain Current (ID):

.35 A

Maximum Drain-Source On Resistance:

6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

1.4 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Element Material:

SILICON

Trade Compliance

BSP89L6327 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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