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BLM6G10-30G

NXP Semiconductors

BLM6G10-30G by NXP Semiconductors

BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: HSOP; Package Shape: RECTANGULAR; JESD-609 Code: e3;

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,587 parts In-Stock

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Anansix

USA . 776 parts In-Stock

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Vyrian

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173

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Distributors (Availability)

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One Stop Electronics

USA . 1,538 parts In-Stock

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$284.000

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UNI Independent Distributors

Spain . 5,011 parts In-Stock

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Corphita

USA . 3,771 parts In-Stock

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Northwest PG Solutions

USA . 1,898 parts In-Stock

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Native Components

USA . 789 parts In-Stock

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Perfect Parts

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Kepictronics

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Technical Specifications

Cellphone ICs BLM6G10-30G attributes and parameters. Explore more Cellphone ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

15.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Qualification:

Not Qualified

Maximum Seated Height:

3.6 mm

Nominal Supply Voltage:

28 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.37 mm

Terminal Position:

DUAL

Width:

11 mm

Trade Compliance

BLM6G10-30G Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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