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BLF7G24L-140,112

NXP Semiconductors

BLF7G24L-140,112 by NXP Semiconductors

BLF7G24L-140,112 by NXP Semiconductors is a single N-channel enhancement mode FET ideal for high-power applications. It supports a max drain current of 28 A and operates up to 200 °C, making it suitable for demanding environments. This MOSFET excels in RF amplification and power management.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 5,306 parts In-Stock

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Digiode

USA . 4,859 parts In-Stock

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Anansix

USA . 1,136 parts In-Stock

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Native Components

USA . 711 parts In-Stock

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$1.020

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711

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Northwest PG Solutions

USA . 331 parts In-Stock

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$1.122

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331

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AZTECH Wire

Italy . 574 parts In-Stock

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$21.140

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One Stop Electronics

USA . 1,300 parts In-Stock

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$41.050

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Corphita

USA . 4,264 parts In-Stock

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UNI Independent Distributors

Spain . 3,983 parts In-Stock

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Overview

Unleash the power of innovation with the BLF7G24L-140,112 from NXP Semiconductors. Renowned for its quality and reliability, this N-channel power FET excels in demanding applications, offering exceptional performance at high temperatures. Experience enhanced efficiency and superior control in your designs, ensuring longevity and robustness. Elevate your projects with a trusted solution that delivers unmatched value and peace of mind.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer higher electron mobility than P-channel FETs, resulting in better performance and efficiency in switching applications.

Configuration: SINGLE

A single configuration provides a simplified circuit design, reducing complexity while ensuring reliable operation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows the FET to remain off at zero gate-source voltage, providing better control and potentially lower power consumption in standby mode.

Maximum Drain Current (Abs) (ID): 28 A

With a high maximum drain current of 28 A, this FET can handle demanding applications and heavy loads efficiently.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables low on-resistance and fast switching speeds, making this FET ideal for high-frequency applications.

Maximum Operating Temperature: 200 °C

A maximum operating temperature of 200 °C allows this FET to operate in harsher environments, providing improved reliability and longevity.

Maximum Drain Current (ID): 28 A

This specification emphasizes the device's capability to manage substantial power outputs, which is crucial for high-performance electronic applications.

Technical Specifications

Power Field Effect Transistors (FET) BLF7G24L-140,112 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

28 A

Maximum Drain Current (ID):

28 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Polarity or Channel Type:

Sub-Category:

FET General Purpose Power

Trade Compliance

BLF7G24L-140,112 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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