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BLF7G10L-250,118

NXP Semiconductors

BLF7G10L-250,118 by NXP Semiconductors

BLF7G10L-250,118 by NXP Semiconductors is a single N-channel MOSFET designed for high-performance applications. It supports a max drain current of 56 A and operates efficiently up to 225 °C. Ideal for power amplification in RF applications, it ensures reliable performance.

Median Price

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Lifecycle Status

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4

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1k+

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RFMW

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Vyrian

USA . 7,781 parts In-Stock

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Digiode

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Anansix

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Native Components

USA . 344 parts In-Stock

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Northwest PG Solutions

USA . 2,023 parts In-Stock

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Component Stockers USA

USA . 581 parts In-Stock

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Corphita

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Overview

Unlock unparalleled performance with the BLF7G10L-250,118 N-channel Power FET from NXP Semiconductors. Renowned for their innovation and quality, NXP delivers a robust solution designed for high-efficiency applications in industrial and telecommunications sectors. With superior thermal management and impressive current handling capabilities, this transistor ensures reliability and longevity, empowering your designs to excel while maximizing efficiency and operational excellence.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer lower on-resistance and higher efficiency compared to P-channel types, making them better suited for high-speed and high-efficiency applications.

Configuration: SINGLE

A single configuration allows for simpler circuit design and integrates well into various electronic applications, facilitating ease of use.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs have good performance characteristics for switching applications, providing a high degree of control and efficiency when compared to depletion mode devices.

Maximum Drain Current (Abs) (ID): 56 A

A maximum drain current of 56 A indicates the ability to handle high loads, making this FET suitable for power applications and high-current circuits without the risk of overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for high input impedance and low power consumption, resulting in better efficiency and performance for a variety of applications.

Maximum Operating Temperature: 225 °C

A high maximum operating temperature ensures reliability and stable performance in extreme thermal environments, expanding the range of applications for this FET.

Technical Specifications

Power Field Effect Transistors (FET) BLF7G10L-250,118 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

56 A

Maximum Drain Current (ID):

56 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

225 Cel

Polarity or Channel Type:

Sub-Category:

FET General Purpose Power

Trade Compliance

BLF7G10L-250,118 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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