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BLF7G10LS-250,112

NXP Semiconductors

BLF7G10LS-250,112 by NXP Semiconductors

NXP Semiconductors BLF7G10LS-250,112 is a N-CHANNEL FET with 56A ID, suitable for high-power applications. It operates in ENHANCEMENT MODE and can handle up to 225°C temperature. Ideal for power amplifiers and RF transmitters due to its high drain current capacity.

Median Price

$96.150

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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RFMW

USA . 240 parts In-Stock

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$96.150

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Rochester

USA . 55 parts In-Stock

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$84.130

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$75.280

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$70.850

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$70.850

DigiKey

USA . 55 parts In-Stock

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Verical

USA . 55 parts In-Stock

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$105.162

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$94.100

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$88.563

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$88.563

Distributors (In-Stock)

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Digiode

USA . 3,660 parts In-Stock

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$88.816

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Vyrian

USA . 5,129 parts In-Stock

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Anansix

USA . 2,842 parts In-Stock

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Flip Electronics

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ACDS - Activité Composants Distribution Service

France . 120 parts In-Stock

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Native Components

USA . 44 parts In-Stock

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$0.218

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$0.209

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Northwest PG Solutions

USA . 80 parts In-Stock

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$0.240

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$0.212

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Corphita

USA . 1,954 parts In-Stock

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$84.141

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Continental Prestige Electronics

USA . 55 parts In-Stock

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$112.180

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Microchip USA

USA . 3,336 parts In-Stock

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$206.402

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UNI Independent Distributors

Spain . 6,727 parts In-Stock

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Overview

Unlock the power of innovation with the BLF7G10LS-250,112 from NXP Semiconductors. Designed for high-performance applications, this N-channel power field effect transistor offers unparalleled reliability and efficiency. Whether you're in the automotive, industrial, or telecommunications industry, this enhancement mode FET delivers exceptional value with its maximum drain current of 56 A. Trust NXP Semiconductors to provide cutting-edge technology that exceeds expectations. Elevate your projects with the BLF7G10LS-250,112 today.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are known for their high efficiency and low ON-state resistance, making them a good choice for power applications.

Configuration: SINGLE

Single configuration FETs are easier to control and typically have lower losses compared to parallel configurations, making them ideal for simpler power designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs require a positive voltage to turn on, which allows for better control and protection against accidental turn-on, making them ideal for power switching applications.

Maximum Drain Current (Abs) (ID): 56 A

With a high maximum drain current, this FET can handle higher power levels without overheating or failing, making it suitable for high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FETs offer high input impedance, low input capacitance, and fast switching speeds, making them ideal for high-frequency applications and efficient power conversion.

Maximum Operating Temperature: 225 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures and harsh environments, ensuring reliable performance in challenging conditions.

Technical Specifications

Power Field Effect Transistors (FET) BLF7G10LS-250,112 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

56 A

Maximum Drain Current (ID):

56 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

225 Cel

Polarity or Channel Type:

Sub-Category:

FET General Purpose Power

Trade Compliance

BLF7G10LS-250,112 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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