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BLF7G15LS-300P,118

NXP Semiconductors

BLF7G15LS-300P,118 by NXP Semiconductors

BLF7G15LS-300P,118 by NXP Semiconductors is an N-channel enhancement mode FET designed for high-performance applications. It supports a max drain current of 45 A and operates at temperatures up to 200 °C. Ideal for RF amplification and power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 1,514 parts In-Stock

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Anansix

USA . 1,308 parts In-Stock

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Vyrian

USA . 951 parts In-Stock

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Native Components

USA . 127 parts In-Stock

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$0.411

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$0.395

127

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Northwest PG Solutions

USA . 978 parts In-Stock

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$0.452

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$0.399

978

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One Stop Electronics

USA . 1,502 parts In-Stock

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$62.050

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UNI Independent Distributors

Spain . 7,395 parts In-Stock

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Corphita

USA . 4,867 parts In-Stock

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Overview

Unlock exceptional performance with the BLF7G15LS-300P,118 from NXP Semiconductors, a leader in innovative technology. This N-channel power FET is engineered for efficiency and reliability, making it ideal for demanding applications like RF amplification and industrial drives. Enjoy enhanced thermal management and robust durability, ensuring your systems run smoothly and efficiently. Elevate your projects with the trusted quality and cutting-edge design that only NXP can deliver.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer higher electron mobility than their P-channel counterparts, resulting in better performance and efficiency in high-speed applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for very low off-state power consumption, making this FET ideal for battery-operated devices and applications requiring efficient on/off control.

Maximum Drain Current (Abs) (ID): 45 A

A maximum drain current rating of 45 A ensures this FET can handle substantial load requirements, making it suitable for power management and motor control applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low power consumption, which are crucial for modern electronic circuits that require minimal energy loss.

Maximum Operating Temperature: 200 °C

With a maximum operating temperature of 200 °C, this FET is capable of functioning in harsh environments, ensuring reliability and longevity in demanding applications.

Technical Specifications

Power Field Effect Transistors (FET) BLF7G15LS-300P,118 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Maximum Drain Current (Abs) (ID):

45 A

Maximum Drain Current (ID):

45 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Polarity or Channel Type:

Sub-Category:

FET General Purpose Powers

Trade Compliance

BLF7G15LS-300P,118 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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