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BLF7G22L-100P,112

NXP Semiconductors

BLF7G22L-100P,112 by NXP Semiconductors

BLF7G22L-100P,112 by NXP Semiconductors is an N-channel enhancement mode MOSFET designed for high-performance applications. It operates at a max temp of 200 °C and withstands peak reflow temps up to 260 °C for 30s. Ideal for power management in RF amplifiers and industrial systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,145 parts In-Stock

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Digiode

USA . 3,741 parts In-Stock

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Anansix

USA . 2,617 parts In-Stock

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Native Components

USA . 704 parts In-Stock

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$14.297

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Northwest PG Solutions

USA . 1,321 parts In-Stock

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$15.727

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$14.154

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AZTECH Wire

Italy . 539 parts In-Stock

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$20.690

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539

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One Stop Electronics

USA . 706 parts In-Stock

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$37.050

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UNI Independent Distributors

Spain . 6,864 parts In-Stock

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Corphita

USA . 1,423 parts In-Stock

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Overview

Experience unparalleled performance with the BLF7G22L-100P,112 from NXP Semiconductors, a leader in innovative technology. This N-channel Power FET combines exceptional efficiency and thermal durability, making it perfect for demanding applications like industrial automation and RF amplification. Trust in NXP's commitment to quality and innovation, and unlock the potential to enhance your designs with reliability and superior power management. Your projects deserve nothing less!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally offer higher electron mobility, resulting in better performance and efficiency in switching applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode provides a normally-off state, allowing for lower power consumption in standby mode and improved design flexibility.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology enables high-speed operation, low power consumption, and minimal heat generation, making it suitable for various applications.

Maximum Operating Temperature: 200 °C

A high maximum operating temperature provides reliability and durability in demanding environments, reducing the need for thermal management.

Maximum Time At Peak Reflow Temperature (s): 30

With only 30 seconds at peak reflow temperature, this transistor minimizes thermal stress, ensuring longevity and performance stability during production.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C allows compatibility with advanced soldering techniques, enhancing build quality and component integrity.

Technical Specifications

Power Field Effect Transistors (FET) BLF7G22L-100P,112 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Sub-Category:

FET General Purpose Power

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BLF7G22L-100P,112 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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