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BLC8G24LS-240AV

NXP Semiconductors

BLC8G24LS-240AV by NXP Semiconductors

BLC8G24LS-240AV by NXP Semiconductors is an N-channel RF power FET designed for amplifier applications. It features a min DS breakdown voltage of 65V, a power gain of 13.3 dB, and operates in the S band. This flatpack device ensures efficient performance in high-temperature environments up to 225 °C.

Median Price

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Lifecycle Status

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1k+

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Flip Electronics

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Digiode

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Anansix

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Vyrian

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Native Components

USA . 608 parts In-Stock

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Northwest PG Solutions

USA . 364 parts In-Stock

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One Stop Electronics

USA . 1,289 parts In-Stock

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Authorized Procurement Solutions

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Overview

Unlock superior performance with the BLC8G24LS-240AV by NXP Semiconductors, a leading name in RF technology. This robust N-channel FET excels in amplification applications, delivering impressive power gain and reliability for S-band communications. Designed for ease of integration with its surface mount capabilities, it ensures seamless operation even in demanding environments. Elevate your projects with a trusted component that combines quality, efficiency, and exceptional value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures lightweight construction and durability, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance, offering high electron mobility and efficiency in amplification.

Configuration: COMMON SOURCE, 2 ELEMENTS

This configuration is favorable for amplifying signals with good gain, making it ideal for RF applications.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this FET is well-suited for enhancing signal strength in RF circuits.

Surface Mount: YES

Surface-mount technology allows for compact designs and easier integration onto circuit boards.

Minimum DS Breakdown Voltage: 65 V

This high breakdown voltage provides robustness against voltage spikes, increasing reliability in high-power applications.

Minimum Power Gain (Gp): 13.3 dB

A minimum gain of 13.3 dB enables efficient signal amplification, making it a good choice for RF amplifiers.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on PCB layouts, optimizing design and electrical performance.

Terminal Form: FLAT

Flat terminals facilitate easy soldering and improve contact with the circuit board, ensuring a stable connection.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation is desirable for low-power applications, contributing to energy efficiency.

Highest Frequency Band: S BAND

The capability to operate in the S band makes this FET suitable for telecommunications and radar applications.

No. of Elements: 2

With two elements, this FET can handle complex amplification tasks and improve signal integrity.

No. of Terminals: 8

An 8-terminal configuration allows for more versatility in circuit design and easier integration into different systems.

Package Style (Meter): FLATPACK

The flatpack style ensures a low-profile design, suitable for space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and low power consumption, ideal for sensitive RF applications.

Maximum Operating Temperature: 225 °C

A high maximum operating temperature indicates that this FET can withstand demanding environments without performance degradation.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material that provides reliable performance in a variety of electronic devices.

Maximum Drain-Source On Resistance: 0.112 ohm

Low on-resistance minimizes power loss and heat generation, enhancing the efficiency of the transistor.

Terminal Position: DUAL

Dual terminal positioning aids in the layout flexibility on the circuit board, accommodating various designs.

Case Connection: SOURCE

Connection to the source terminal offers ease of integration into circuits, promoting design efficiency.

Reference Standard: IEC-60134

Compliance with IEC-60134 ensures that the product meets international standards for quality and reliability.

Technical Specifications

RF Power Field Effect Transistors (FET) BLC8G24LS-240AV attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain-Source On Resistance:

.112 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

S BAND

JESD-30 Code:

R-PDFP-F8

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

225 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLATPACK

Polarity or Channel Type:

Minimum Power Gain (Gp):

13.3 dB

Reference Standard:

IEC-60134

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BLC8G24LS-240AV Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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