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BGU8011X

NXP Semiconductors

BGU8011X by NXP Semiconductors

NXP Semiconductors' BGU8011X is a BICMOS RF amplifier with 6 terminals, operating from -40 to 85°C. It has a power supply range of 1.8-2.85V and surface mount package, ideal for RF & microwave applications.

Median Price

$0.429

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 19,192 parts In-Stock

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-

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$0.429

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$0.356

10k+ parts

$0.318

19,192

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$0.429

$0.356

$0.318

DigiKey

USA . 19,192 parts In-Stock

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$0.400

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$0.400

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$0.400

$0.400

Verical

USA . 15,714 parts In-Stock

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$0.446

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$0.397

15,714

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$0.446

$0.397

Distributors (In-Stock)

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Digiode

USA . 1,896 parts In-Stock

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$0.333

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Vyrian

USA . 2,191 parts In-Stock

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$0.351

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DigiKey Marketplace

USA . 15,714 parts In-Stock

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VNN

France . 3,404 parts In-Stock

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Anansix

USA . 2,625 parts In-Stock

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Nova Conductors

Japan . 97 parts In-Stock

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Semicontronic

India . 19,099 parts In-Stock

1+ parts

$0.298

100+ parts

$0.291

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$0.289

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19,099

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$0.289

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Ampacity Inc.

Singapore . 18,920 parts In-Stock

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$0.298

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Corphita

USA . 3,643 parts In-Stock

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$0.316

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Corohmni

South Africa . 631 parts In-Stock

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$0.367

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631

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Kepictronics

USA . 15,000 parts In-Stock

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UNI Independent Distributors

Spain . 4,635 parts In-Stock

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Argo Parts USA

USA . 2,861 parts In-Stock

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Continental Prestige Electronics

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Elevate your RF and microwave amplification with the BGU8011X by NXP Semiconductors. Known for their top-quality semiconductor solutions, NXP delivers reliability and performance in every product. This amplifier is perfect for applications requiring precise signal boosting in a compact package. With an operating temperature range of -40°C to 85°C and easy surface mount installation, the BGU8011X offers value and efficiency to customers looking to enhance their electronic designs. Experience seamless integration and superior amplification with NXP's BGU8011X.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability, resistance to external factors, and ease of handling and installation.

Power Supplies (V): 1.8/2.85

Compatibility with common power supply voltages makes it easy to integrate into existing systems.

No. of Terminals: 6

Having 6 terminals allows for flexible connection options and a wider range of applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in extreme cold environments without compromising performance.

Technology: BICMOS

BICMOS technology offers a good balance between high-speed operation and low-power consumption, making the amplifier efficient and reliable.

Mounting Feature: SURFACE MOUNT

Surface mount design simplifies installation and allows for more compact and efficient system designs.

Technical Specifications

RF & Microwave Amplifiers BGU8011X attributes and parameters. Explore more RF & Microwave Amplifiers devices from NXP Semiconductors

Specs

Mounting Feature:

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

SOLCC6,.04,16

Power Supplies (V):

1.8/2.85

Sub-Category:

RF/Microwave Amplifiers

Technology:

Trade Compliance

BGU8011X RF & Microwave trade compliance attributes, and parameters.

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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