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BBY62TRL13

NXP Semiconductors

BBY62TRL13 by NXP Semiconductors

BBY62TRL13 by NXP Semiconductors is a variable capacitance diode designed for ultra-high frequency applications. It features a nominal capacitance of 17.5 pF, a min capacitance ratio of 9.7, and comes in a compact surface mount package with 4 terminals. Ideal for tuning circuits and RF applications, it ensures efficient performance in small electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,744 parts In-Stock

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Anansix

USA . 2,392 parts In-Stock

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2,392

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Vyrian

USA . 128 parts In-Stock

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128

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Native Components

USA . 153 parts In-Stock

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$0.445

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$0.427

153

$0.445

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$0.427

Northwest PG Solutions

USA . 672 parts In-Stock

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$0.489

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$0.431

672

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$0.431

One Stop Electronics

USA . 985 parts In-Stock

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$2.010

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985

$2.010

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UNI Independent Distributors

Spain . 6,898 parts In-Stock

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Corphita

USA . 2,950 parts In-Stock

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2,950

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Overview

Unlock new levels of innovation with the BBY62TRL13 from NXP Semiconductors, a leader in cutting-edge technology. This advanced varactor diode delivers exceptional performance for ultra-high frequency applications, ensuring reliability and precision. Its compact design and superior plastic/epoxy body enhance efficiency while simplifying integration into your projects. Elevate your designs with a component that promises quality, versatility, and unmatched value—ideal for tuning circuits and RF applications!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material enhances reliability and ensures protection against environmental factors.

Config: SEPARATE, 2 ELEMENTS

A separate 2-element configuration allows for better tuning and performance in applications requiring variable capacitance.

Frequency Band: ULTRA HIGH FREQUENCY

Designed for ultra-high frequency applications, this varactor diode delivers optimal performance in RF circuits.

Surface Mount: YES

The surface mount capability allows for easy integration into compact PCB designs, saving space and improving assembly efficiency.

Package Shape: RECTANGULAR

The rectangular package shape provides a standard footprint that facilitates easy placement and alignment on PCBs.

No. of Terminals: 4

With four terminals, this component offers flexibility in circuit design and enhances connectivity options.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for miniaturized designs, making it suitable for portable and compact electronic devices.

Terminal Position: DUAL

The dual terminal position simplifies the mounting process and enhances mechanical stability within the circuit.

Nominal Diode Capacitance: 17.5 pF

A nominal capacitance of 17.5 pF provides targeted tuning capabilities in various RF and microwave applications.

Diode Type: VARIABLE CAPACITANCE DIODE

As a variable capacitance diode, it is specifically designed for applications requiring voltage-controlled capacitance adjustments.

Terminal Form: GULL WING

The gull wing terminal form ensures secure mounting and facilitates easy soldering processes in automated assembly lines.

No. of Elements: 2

Having two elements allows for enhanced performance in multi-functionality applications, providing more design flexibility.

Diode Element Material: SILICON

The use of silicon as the diode element material contributes to high efficiency and improved thermal stability.

Minimum Diode Capacitance Ratio: 9.7

A minimum capacitance ratio of 9.7 indicates a significant range of capacitance variation, making it ideal for tuning applications.

Technical Specifications

Varactor Diodes BBY62TRL13 attributes and parameters. Explore more Varactor Diodes devices from NXP Semiconductors

Specs

Config:

SEPARATE, 2 ELEMENTS

Minimum Diode Capacitance Ratio:

9.7

Nominal Diode Capacitance:

17.5 pF

Diode Element Material:

SILICON

Frequency Band:

ULTRA HIGH FREQUENCY

JESD-30 Code:

R-PDSO-G4

No. of Elements:

2

No. of Terminals:

4

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

Terminal Position:

Trade Compliance

BBY62TRL13 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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