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BB181

NXP Semiconductors

BB181 by NXP Semiconductors

VARIABLE CAPACITANCE DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Lantek

USA . 26,644 parts In-Stock

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Zilex Electronics Inc.

Canada . 6,000 parts In-Stock

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Digiode

USA . 4,446 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,794 parts In-Stock

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Bristol Electronics

USA . 2,794 parts In-Stock

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Dan-Mar Components

USA . 2,794 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,260 parts In-Stock

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Anansix

USA . 682 parts In-Stock

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Vyrian

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Distributors (Availability)

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One Stop Electronics

USA . 814 parts In-Stock

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$0.010

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Microchip USA

USA . 1,699 parts In-Stock

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$0.036

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Native Components

USA . 921 parts In-Stock

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$11.120

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Northwest PG Solutions

USA . 1,048 parts In-Stock

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$12.232

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$11.009

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$12.232

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Metaverse IC Inc.

Canada . 87,000 parts In-Stock

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Authorized Procurement Solutions

USA . 42,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 22,565 parts In-Stock

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GreenTree Electronics

Israel . 19,926 parts In-Stock

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Kepictronics

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 9,000 parts In-Stock

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Perfect Parts

USA . 8,366 parts In-Stock

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UNI Independent Distributors

Spain . 5,655 parts In-Stock

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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Assy Fe

Spain . 1,890 parts In-Stock

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Corphita

USA . 1,382 parts In-Stock

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Technical Specifications

Varactor Diodes BB181 attributes and parameters. Explore more Varactor Diodes devices from NXP Semiconductors

Specs

Config:

SINGLE

Diode Cap Tolerance:

36 %

Minimum Diode Capacitance Ratio:

12

Diode Element Material:

SILICON

Frequency Band:

VERY HIGH FREQUENCY

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

30 V

Sub-Category:

Varactors

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BB181 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00

SB

8541.10.00.80

NSN

6650-00-407-5883, 6650004075883

NIIN

004075883

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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