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BB204G-AMMOPAK

NXP Semiconductors

BB204G-AMMOPAK by NXP Semiconductors

BB204G-AMMOPAK by NXP Semiconductors is a variable capacitance diode featuring a 2.5 min capacitance ratio and a cylindrical plastic/epoxy package. With 3 terminals in a common cathode config, it’s ideal for RF tuning applications. Its silicon elements ensure reliable performance in various circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,852 parts In-Stock

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3,852

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Anansix

USA . 1,470 parts In-Stock

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1,470

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Digiode

USA . 768 parts In-Stock

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768

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Distributors (Availability)

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One Stop Electronics

USA . 1,003 parts In-Stock

1+ parts

$0.010

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1,003

$0.010

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Native Components

USA . 85 parts In-Stock

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$5.070

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85

$5.070

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Corphita

USA . 4,915 parts In-Stock

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4,915

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UNI Independent Distributors

Spain . 3,972 parts In-Stock

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3,972

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Northwest PG Solutions

USA . 10 parts In-Stock

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$4.969

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10

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$4.969

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Overview

Unlock the potential of your electronic designs with the BB204G-AMMOPAK from NXP Semiconductors. Renowned for their commitment to quality and innovation, NXP empowers engineers with this versatile varactor diode, ideal for tuning applications and frequency modulation. Its robust plastic/epoxy package ensures durability, while its engineered silicon elements deliver exceptional performance. Elevate your projects with reliability and precision that only NXP can offer!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material offers durability and resistance to environmental factors, making the diode suitable for various applications.

Config: COMMON CATHODE, 2 ELEMENTS

The common cathode configuration allows for easier integration into circuits, improving design flexibility and space efficiency.

Package Shape: ROUND

The round shape can facilitate effective heat dissipation and compact design, helping to improve thermal management.

No. of Terminals: 3

Three terminals provide enhanced connectivity options, enabling straightforward integration into various electronic circuits.

Package Style (Meter): CYLINDRICAL

The cylindrical package style allows for efficient use of space in circuit boards, which can be critical in compact designs.

Terminal Position: BOTTOM

With bottom terminal positioning, the diode can be mounted flush with the PCB surface, which aids in space management and reduces profile height.

Diode Type: VARIABLE CAPACITANCE DIODE

As a variable capacitance diode, it can be used for tuning applications, making it essential in RF and communication systems.

Terminal Form: THROUGH-HOLE

The through-hole terminal form ensures secure physical connections in a circuit, providing reliability and robustness under varying conditions.

No. of Elements: 2

Having two elements allows for greater functionality and versatility in circuit design, particularly in applications requiring phase shifting or frequency tuning.

Diode Element Material: SILICON

Silicon is known for its excellent electrical properties, enhancing the overall performance and efficiency of the diode.

Minimum Diode Capacitance Ratio: 2.5

A minimum capacitance ratio of 2.5 signifies a good range of capacitance variation, making it effective for tuning and frequency modulation applications.

Technical Specifications

Varactor Diodes BB204G-AMMOPAK attributes and parameters. Explore more Varactor Diodes devices from NXP Semiconductors

Specs

Config:

COMMON CATHODE, 2 ELEMENTS

Minimum Diode Capacitance Ratio:

2.5

Diode Element Material:

SILICON

JESD-30 Code:

O-PBCY-T3

No. of Elements:

2

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

CYLINDRICAL

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

Terminal Position:

Trade Compliance

BB204G-AMMOPAK Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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