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BB204B-AMMOPAK

NXP Semiconductors

BB204B-AMMOPAK by NXP Semiconductors

BB204B-AMMOPAK by NXP Semiconductors is a variable capacitance diode featuring a common cathode configuration with 2 elements. It has a min capacitance ratio of 2.5 and comes in a cylindrical plastic/epoxy package, ideal for RF tuning applications. With its through-hole design and silicon material, it ensures reliable performance in various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

< 1k

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Anansix

USA . 143 parts In-Stock

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Vyrian

USA . 87 parts In-Stock

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87

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Digiode

USA . 75 parts In-Stock

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75

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Distributors (Availability)

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One Stop Electronics

USA . 449 parts In-Stock

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$0.010

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$0.010

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Native Components

USA . 490 parts In-Stock

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$59.307

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$56.935

490

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$56.935

Northwest PG Solutions

USA . 1,298 parts In-Stock

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$65.238

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$65.238

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UNI Independent Distributors

Spain . 3,427 parts In-Stock

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Corphita

USA . 188 parts In-Stock

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Overview

Unlock unparalleled performance with the BB204B-AMMOPAK by NXP Semiconductors, a leader in innovative electronic solutions. This versatile varactor diode excels in RF applications, delivering superior quality and reliability. Its compact design ensures seamless integration into your projects, enhancing signal tuning and frequency modulation. Trust NXP for cutting-edge technology that brings efficiency and value to your designs—experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body offers durability and resistance to environmental factors, ensuring long-lasting performance and reliability.

Config: COMMON CATHODE, 2 ELEMENTS

The common cathode configuration with two elements enhances circuit design flexibility, making it suitable for various applications requiring variable capacitance.

Package Shape: ROUND

A round package shape optimizes space and facilitates easy integration into various electronic circuits, adding to the product's versatility.

No. of Terminals: 3

With three terminals, this component allows for straightforward connections in circuit designs, helping to simplify installation and reduce assembly complexity.

Package Style (Meter): CYLINDRICAL

The cylindrical package style allows for compact configurations in applications where space is limited, making it a practical choice for dense circuit layouts.

Terminal Position: BOTTOM

The bottom terminal position aids in easy mounting and optimizing the layout of printed circuit boards, enhancing overall design efficiency.

Diode Type: VARIABLE CAPACITANCE DIODE

As a variable capacitance diode, it provides tunable capacitance, making it ideal for applications such as voltage-controlled oscillators and frequency modulation.

Terminal Form: THROUGH-HOLE

The through-hole terminal form ensures robust mechanical stability and reliable electrical connections, which is crucial for durability in electronic applications.

No. of Elements: 2

Having two elements allows for more complex circuit functionality while maintaining a compact design, suitable for advanced applications.

Diode Element Material: SILICON

Silicon diode elements provide excellent performance characteristics, including high stability and efficiency, ensuring reliable operation in various conditions.

Minimum Diode Capacitance Ratio: 2.5

A minimum capacitance ratio of 2.5 enables effective tuning capabilities, allowing for increased functionality in applications that require precise capacitive adjustments.

Technical Specifications

Varactor Diodes BB204B-AMMOPAK attributes and parameters. Explore more Varactor Diodes devices from NXP Semiconductors

Specs

Config:

COMMON CATHODE, 2 ELEMENTS

Minimum Diode Capacitance Ratio:

2.5

Diode Element Material:

SILICON

JESD-30 Code:

O-PBCY-T3

No. of Elements:

2

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

CYLINDRICAL

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

Terminal Position:

Trade Compliance

BB204B-AMMOPAK Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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