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ACT108-600D,126

NXP Semiconductors

ACT108-600D,126 by NXP Semiconductors

The NXP Semiconductors ACT108-600D,126 is a TRIAC with 1.3V max on-state voltage, 5mA max DC gate trigger current, and 0.2mA max leakage current. It operates b/w -40°C to 150°C and has a repetitive peak off-state voltage of 600V. Ideal for AC power control applications requiring precise switching capabilities.

Median Price

$0.218

Lifecycle Status

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9

In-Stock Inventory

1k+

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Mouser Electronics

USA . 9,608 parts In-Stock

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$1.000

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$0.444

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$0.257

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$0.144

9,608

$1.000

$0.444

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$0.144

Rochester

USA . 14,000 parts In-Stock

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$0.196

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$0.162

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$0.145

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DigiKey

USA . 14,000 parts In-Stock

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$0.240

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Verical

USA . 14,000 parts In-Stock

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$0.181

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Digiode

USA . 4,751 parts In-Stock

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$0.152

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Vyrian

USA . 4,573 parts In-Stock

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Rebound Electronics

UK . 42,000 parts In-Stock

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Anansix

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ACDS - Activité Composants Distribution Service

France . 200 parts In-Stock

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Corphita

USA . 1,893 parts In-Stock

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$0.144

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Northwest PG Solutions

USA . 1,677 parts In-Stock

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$2.376

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QUARKTWIN TECHNOLOGY LTD

USA . 26,602 parts In-Stock

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UNI Independent Distributors

Spain . 7,850 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Native Components

USA . 346 parts In-Stock

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

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Overview

Experience the superior quality and reliability of the ACT108-600D,126 by NXP Semiconductors, a top-tier manufacturer known for cutting-edge technology. This TRIAC offers precise control and efficient power management, making it ideal for a wide range of applications. With a maximum on-state voltage of 1.3V and a repetitive peak off-state voltage of 600V, this versatile device ensures optimal performance even in challenging conditions. Trust NXP Semiconductors to deliver innovative solutions that exceed expectations. Elevate your projects with the ACT108-600D,126 and enjoy seamless operations and enhanced productivity.

Feature Benefit Bullets

Maximum On-state Voltage: 1.3 V

Low voltage drop ensures efficient operation and minimal power loss.

Maximum DC Gate Trigger Current: 5 mA

Allows for reliable triggering of the TRIAC.

Maximum Leakage Current: 0.2 mA

Low leakage current ensures energy efficiency and reduces power consumption when not in operation.

Maximum Operating Temperature: 150 °C

Can operate in high temperature environments without a risk of overheating and damage.

Trigger Device Type: TRIAC

Utilizing TRIAC technology allows for precise control over the switching of alternating current.

Repetitive Peak Off-state Voltage: 600 V

Can handle high voltages, making it suitable for a wide range of applications.

Maximum Holding Current: 20 mA

Ability to maintain current flow after triggering, ensuring stable operation.

Peak Reflow Temperature °C: 260

Able to withstand high reflow temperatures during manufacturing processes.

Technical Specifications

Triode For Alternating Current (TRIAC) ACT108-600D,126 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from NXP Semiconductors

Specs

Minimum Critical Rate of Rise of Off-state Voltage:

300 V/us

Maximum DC Gate Trigger Current:

5 mA

Maximum DC Gate Trigger Voltage:

.9 V

Maximum Holding Current:

20 mA

JESD-609 Code:

e3

Maximum Leakage Current:

.2 mA

Maximum On-state Voltage:

1.3 V

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Peak Reflow Temperature (C):

260

Maximum RMS On-state Current:

.8 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Device Type:

Trade Compliance

ACT108-600D,126 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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