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ACT108-600D,412

NXP Semiconductors

ACT108-600D,412 by NXP Semiconductors

ACT108-600D,412 by NXP Semiconductors is a TRIAC designed for AC applications. It features a max on-state voltage of 1.3 V, operates at up to 600 V off-state voltage, and withstands temps from -40 °C to 150 °C. Ideal for controlling power in lighting and motor circuits.

Median Price

$0.218

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 19,820 parts In-Stock

1+ parts

-

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$0.196

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$0.162

10k+ parts

$0.145

19,820

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$0.196

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$0.145

DigiKey

USA . 19,820 parts In-Stock

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-

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$0.240

19,820

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$0.240

Distributors (In-Stock)

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Digiode

USA . 356 parts In-Stock

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$0.152

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356

$0.152

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Vyrian

USA . 2,802 parts In-Stock

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$0.160

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Anansix

USA . 2,579 parts In-Stock

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2,579

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Distributors (Availability)

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Corphita

USA . 1,349 parts In-Stock

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$0.144

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1,349

$0.144

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Component Stockers USA

USA . 17,007 parts In-Stock

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$0.170

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$0.160

1k+ parts

$0.140

10k+ parts

$0.140

17,007

$0.170

$0.160

$0.140

$0.140

Native Components

USA . 262 parts In-Stock

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$1.400

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262

$1.400

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Northwest PG Solutions

USA . 1,673 parts In-Stock

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$1.540

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$1.540

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QUARKTWIN TECHNOLOGY LTD

USA . 24,826 parts In-Stock

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Microchip USA

USA . 14,929 parts In-Stock

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UNI Independent Distributors

Spain . 8,335 parts In-Stock

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Overview

Unlock the potential of your designs with the ACT108-600D,412 from NXP Semiconductors—the trusted leader in innovative electronic solutions. This high-performance TRIAC is engineered for reliability and efficiency, perfect for a wide array of applications including lighting control and motor management. With exceptional thermal stability and robust performance, it ensures long-lasting operation, giving you peace of mind and enhancing your product's value. Choose NXP for quality that empowers your success!

Feature Benefit Bullets

Maximum On-state Voltage: 1.3 V

A low on-state voltage ensures minimal power losses during operation, making this TRIAC efficient and suitable for energy-saving applications.

Maximum DC Gate Trigger Current: 5 mA

A low gate trigger current means reduced power consumption for triggering the TRIAC, which enhances overall circuit efficiency and allows for easier integration.

Maximum Leakage Current: 0.2 mA

With minimal leakage current, this TRIAC prevents unwanted power loss when in the off-state, contributing to improved performance and reliability.

Maximum Operating Temperature: 150 °C

A high operating temperature allows this TRIAC to function reliably in demanding environments and under high thermal stress, broadening its application scope.

Trigger Device Type: TRIAC

Being a TRIAC allows for efficient control of AC power, making it an excellent choice for a variety of AC load applications.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this TRIAC suitable for harsh environments, thereby extending its applicability in various climates.

Terminal Finish: TIN

The use of TIN finish promotes better solderability, making the installation process easier and ensuring long-term reliability of connections.

Maximum RMS On-state Current: 0.8 A

A considerable maximum RMS current rating allows this TRIAC to handle significant loads, which is crucial for various power control applications.

Maximum DC Gate Trigger Voltage: 0.9 V

A low DC trigger voltage enables compatibility with low-voltage control systems, enhancing adaptability in various electronic designs.

Repetitive Peak Off-state Voltage: 600 V

High off-state voltage capability ensures reliable operation in high-voltage applications, increasing the robustness and versatility of this TRIAC.

Minimum Critical Rate of Rise of Off-state Voltage: 300 V/μs

A high rate of rise ensures that the TRIAC can quickly turn off, minimizing the risk of damage from voltage spikes and improving overall circuit protection.

Maximum Holding Current: 20 mA

The low holding current allows the TRIAC to maintain control with minimal power draw, adding to the efficiency of the overall system.

Maximum Time At Peak Reflow Temperature: 30 s

A reasonable reflow time ensures that the TRIAC can withstand soldering processes without compromising its reliability, simplifying manufacturing.

Peak Reflow Temperature: 260 °C

The ability to endure high reflow temperatures ensures compatibility with modern soldering techniques, facilitating ease of production and assembly.

Technical Specifications

Triode For Alternating Current (TRIAC) ACT108-600D,412 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from NXP Semiconductors

Specs

Minimum Critical Rate of Rise of Off-state Voltage:

300 V/us

Maximum DC Gate Trigger Current:

5 mA

Maximum DC Gate Trigger Voltage:

.9 V

Maximum Holding Current:

20 mA

JESD-609 Code:

e3

Maximum Leakage Current:

.2 mA

Maximum On-state Voltage:

1.3 V

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Peak Reflow Temperature (C):

260

Maximum RMS On-state Current:

.8 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Device Type:

Trade Compliance

ACT108-600D,412 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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