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74AUP2T1326GF,132

NXP Semiconductors

74AUP2T1326GF,132 by NXP Semiconductors

74AUP2T1326GF,132 by NXP Semiconductors is a dual bus driver with a propagation delay of just 5.8 ns and operates across 1.2/3.3V power supplies. It features a compact no-lead package and supports industrial applications with a max temp of 85 °C. Ideal for low-capacitance signal transmission in space-constrained designs.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Chip Stock

USA . 45,000 parts In-Stock

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Digiode

USA . 4,323 parts In-Stock

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Vyrian

USA . 2,556 parts In-Stock

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Anansix

USA . 1,267 parts In-Stock

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Microchip USA

USA . 260 parts In-Stock

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$1.885

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One Stop Electronics

USA . 684 parts In-Stock

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$4.000

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Andel Nordic

Denmark . 291 parts In-Stock

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$7.880

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$5.513

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291

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$5.513

AZTECH Wire

Italy . 768 parts In-Stock

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$17.620

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768

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Corphita

USA . 3,539 parts In-Stock

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UNI Independent Distributors

Spain . 2,590 parts In-Stock

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Northwest PG Solutions

USA . 1,660 parts In-Stock

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Native Components

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Overview

Elevate your designs with the 74AUP2T1326GF,132 from NXP Semiconductors—a trusted leader in innovative solutions. This compact and efficient bus driver & transceiver enhances system performance while ensuring low power consumption. Ideal for industrial applications, it provides reliability across a wide temperature range. Experience seamless integration, robust functionality, and exceptional quality that empowers you to create smarter, more efficient electronic systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and resistance to environmental factors, making the product reliable in various applications.

Propagation Delay At Nominal Supply: 5.8 ns

A short propagation delay indicates fast switching speeds, which is essential for high-performance digital circuits.

Surface Mount: YES

Surface mount technology allows for compact designs and improved performance due to shorter lead lengths.

Package Shape: RECTANGULAR

The rectangular package shape is efficient for layout planning on printed circuit boards, optimizing space usage.

No. of Bits: 2

Having 2 bits enables the product to handle a wider range of digital signals, facilitating versatile applications.

Load Capacitance (CL): 10 pF

A low load capacitance helps in maintaining faster signal integrity and reduces power dissipation.

Power Supplies (V): 1.2/3.3

Dual supply voltage options provide flexibility in design, allowing compatibility with various systems.

No. of Terminals: 6

Having 6 terminals allows for multiple connections, enhancing functionality and integration into circuit designs.

Package Style (Meter): SMALL OUTLINE

A small outline package style is ideal for space-constrained applications, facilitating compact designs.

Maximum I (ol): 3 Amp

A high maximum output current capability means this product can drive loads effectively, suitable for demanding applications.

Maximum Operating Temperature: 85 °C

The product can operate at elevated temperatures, which is critical for reliability in industrial environments.

Output Characteristics: 3-STATE

3-state output characteristics enhance design flexibility, allowing for multiple devices to connect to a common bus.

Minimum Operating Temperature: -40 °C

Operation in extreme low temperatures makes this product suitable for harsh environmental conditions.

Terminal Position: DUAL

Dual terminal positions provide better layout options for designers, promoting ease of integration.

Output Polarity: TRUE

True output polarity ensures straightforward connectivity for positive logic systems.

Temperature Grade: INDUSTRIAL

An industrial temperature grade guarantees reliability and performance in demanding conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: NO LEAD

No-lead terminal form improves the reliability of solder joints and minimizesboard space usage.

Packing Method: TR

Through-hole packing allows for easy handling and placement during assembly, streamlining manufacturing processes.

Terminal Pitch: 0.35 mm

A terminal pitch of 0.35 mm is suitable for high-density applications, facilitating compact circuit board designs.

Control Type: ENABLE HIGH

A high enable control type simplifies integration into systems, allowing for easyactivation and control of the device.

Technical Specifications

Bus Driver & Transceivers 74AUP2T1326GF,132 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

ENABLE HIGH

JESD-30 Code:

R-PDSO-N6

Load Capacitance (CL):

10 pF

Logic IC Type:

Maximum I (ol):

3 Amp

No. of Bits:

2

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC6,.04,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

5.8 ns

Qualification:

Not Qualified

Sub-Category:

Bus Driver/Transceivers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Trade Compliance

74AUP2T1326GF,132 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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