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74AUC16374DGVRG4

Texas Instruments

74AUC16374DGVRG4 by Texas Instruments

74AUC16374DGVRG4 by Texas Instruments is a Bus Driver & Transceiver with 8 bits, 2 functions, and a propagation delay of 4.5 ns at 1.2V. It operates in industrial temperatures, has a max frequency of 250MHz, and is suitable for applications requiring fast signal transmission in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,829 parts In-Stock

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Vyrian

USA . 2,136 parts In-Stock

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2,136

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Distributors (Availability)

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Parana Technologies

USA . 883 parts In-Stock

1+ parts

$12.413

100+ parts

-

1k+ parts

$12.851

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883

$12.413

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$12.851

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AZTECH Wire

Italy . 316 parts In-Stock

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$12.564

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316

$12.564

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DigiPath Technology Company

USA . 1,199 parts In-Stock

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$13.668

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$13.668

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ChromeModa Solutions

Germany . 5,383 parts In-Stock

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$13.947

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$11.437

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5,383

$13.947

$11.437

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IDEA Electronic Components Group

UK . 838 parts In-Stock

1+ parts

$13.947

100+ parts

$13.250

1k+ parts

$12.552

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838

$13.947

$13.250

$12.552

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Native Components

USA . 197 parts In-Stock

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$20.555

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197

$20.555

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Northwest PG Solutions

USA . 1,787 parts In-Stock

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$22.611

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$20.349

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One Stop Electronics

USA . 1,026 parts In-Stock

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$44.000

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$44.000

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Andel Nordic

Denmark . 586 parts In-Stock

1+ parts

$72.801

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$69.889

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$69.889

586

$72.801

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$69.889

$69.889

Corphita

USA . 275 parts In-Stock

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Overview

Elevate your electronics projects with the 74AUC16374DGVRG4 by Texas Instruments, a top-tier manufacturer known for cutting-edge technology and reliability. As a leading Bus Driver & Transceiver in its category, this product boasts a range of applications and benefits, from efficient data transmission to seamless connectivity. With a focus on quality and performance, Texas Instruments delivers value and innovation to customers seeking superior components for their designs. Experience the difference with the 74AUC16374DGVRG4 and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for electronic components in vehicles that need to withstand vibrations and impact.

Propagation Delay At Nominal Supply: 4.5 ns

Low propagation delay ensures fast and efficient communication between components, making the product suitable for high-speed data transmission in bus systems.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and resources during manufacturing.

No. of Functions: 2

Having multiple functions in a single component reduces the need for additional components, leading to a more streamlined and cost-effective design.

Nominal Supply Voltage / Vsup (V): 1.2

Operating at a nominal supply voltage of 1.2V makes the product energy-efficient and compatible with a wide range of electronic systems.

Load Capacitance (CL): 15 pF

The low load capacitance ensures stability and reliability in signal transmission, especially in high-frequency applications.

Power Supplies (V): 1.2/2.5

Having multiple power supply options provides flexibility in the voltage requirements of the product, making it adaptable to different system configurations.

No. of Terminals: 48

With a high number of terminals, the product offers ample connectivity options for interfacing with various components in a bus system.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and slender package style saves space on the circuit board, making it suitable for applications with limited real estate.

Maximum I (ol): 5 Amp

The high maximum output current capability allows the product to drive power-hungry components without the need for additional drivers.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures reliable performance in harsh environments, making the product suitable for automotive applications.

Maximum Frequency At Nominal Supply: 250000000 Hz

The high maximum frequency capability enables the product to handle high-speed data transmission requirements in bus systems efficiently.

Technical Specifications

Bus Driver & Transceivers 74AUC16374DGVRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

AUC

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

9.7 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

250000000 Hz

Maximum I (ol):

5 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/2.5

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

4.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

74AUC16374DGVRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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