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74AUC16244DGVRG4

Texas Instruments

74AUC16244DGVRG4 by Texas Instruments

74AUC16244DGVRG4 by Texas Instruments is a bus driver & transceiver with 2.8 ns propagation delay, 4 functions, and 1.2V nominal voltage. It is used in industrial applications requiring CMOS technology for signal transmission with a small outline package style and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,267 parts In-Stock

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Digiode

USA . 4,179 parts In-Stock

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4,179

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Distributors (Availability)

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Native Components

USA . 881 parts In-Stock

1+ parts

$2.030

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881

$2.030

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Northwest PG Solutions

USA . 1,480 parts In-Stock

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$2.233

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1,480

$2.233

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Andel Nordic

Denmark . 37 parts In-Stock

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$5.570

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-

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$5.347

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$5.347

37

$5.570

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$5.347

$5.347

AZTECH Wire

Italy . 404 parts In-Stock

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$14.315

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404

$14.315

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Parana Technologies

USA . 2,164 parts In-Stock

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$19.684

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$19.680

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2,164

$19.684

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$19.680

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DigiPath Technology Company

USA . 2,338 parts In-Stock

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$21.675

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2,338

$21.675

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ChromeModa Solutions

Germany . 3,688 parts In-Stock

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$22.117

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$18.136

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IDEA Electronic Components Group

UK . 72 parts In-Stock

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$22.117

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$21.011

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$19.905

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72

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$19.905

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One Stop Electronics

USA . 1,093 parts In-Stock

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$64.000

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$64.000

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Corphita

USA . 4,795 parts In-Stock

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Robosynatics

Brazil . 100 parts In-Stock

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Lucentia Tech

USA . 100 parts In-Stock

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$15.244

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$14.116

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$14.116

100

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$15.244

$14.116

$14.116

Overview

Elevate your electronic designs with the 74AUC16244DGVRG4 by Texas Instruments, a reliable and high-quality bus driver & transceiver. Crafted by a reputable manufacturer, this product offers exceptional performance and precision for various applications. With its advanced features and compact design, this chip provides value, efficiency, and versatility to customers seeking seamless connectivity solutions. Trust in Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the internal components of the bus driver & transceiver, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 2.8 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed bus communication applications.

Surface Mount: YES

Allows for easy and efficient integration onto circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 1.2

Operates at a standard voltage level, ensuring compatibility with a variety of systems and devices.

Load Capacitance (CL): 15 pF

Optimized load capacitance helps in reducing signal distortion and improving overall signal integrity.

Technical Specifications

Bus Driver & Transceivers 74AUC16244DGVRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

AUC

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

9.7 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

5 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/2.5

Propagation Delay At Nominal Supply:

2.8 ns

Propagation Delay (tpd):

2.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74AUC16244DGVRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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