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74AUC16240DGVRG4

Texas Instruments

74AUC16240DGVRG4 by Texas Instruments

74AUC16240DGVRG4 by Texas Instruments is a bus driver with 4 functions, operating at 1.2V, and featuring a propagation delay of 2.6ns. It is used in industrial applications requiring a compact design and low power consumption, suitable for surface mount installations with a small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,314 parts In-Stock

1+ parts

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4,314

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Digiode

USA . 2,570 parts In-Stock

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2,570

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 429 parts In-Stock

1+ parts

$5.308

100+ parts

-

1k+ parts

$5.095

10k+ parts

$5.095

429

$5.308

-

$5.095

$5.095

Native Components

USA . 963 parts In-Stock

1+ parts

$5.995

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-

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963

$5.995

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AZTECH Wire

Italy . 496 parts In-Stock

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$16.294

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496

$16.294

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Parana Technologies

USA . 1,623 parts In-Stock

1+ parts

$17.569

100+ parts

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$17.768

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1,623

$17.569

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$17.768

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DigiPath Technology Company

USA . 1,010 parts In-Stock

1+ parts

$19.346

100+ parts

$17.798

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1,010

$19.346

$17.798

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ChromeModa Solutions

Germany . 1,943 parts In-Stock

1+ parts

$19.741

100+ parts

$16.188

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1,943

$19.741

$16.188

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IDEA Electronic Components Group

UK . 1,588 parts In-Stock

1+ parts

$19.741

100+ parts

$18.754

1k+ parts

$17.767

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1,588

$19.741

$18.754

$17.767

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One Stop Electronics

USA . 845 parts In-Stock

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$35.000

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845

$35.000

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Northwest PG Solutions

USA . 1,927 parts In-Stock

1+ parts

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$5.875

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1,927

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$5.875

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Corphita

USA . 934 parts In-Stock

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934

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Overview

Elevate your electronic projects with the 74AUC16240DGVRG4 by Texas Instruments, a top-tier bus driver and transceiver designed to deliver unmatched quality and performance. From its durable plastic/epoxy construction to its impressive 3-STATE output characteristics, this versatile component is a game-changer for a variety of applications. With a nominal supply voltage of 1.2V and a propagation delay of just 2.6ns, this product offers customers unparalleled speed and efficiency. Trust in Texas Instruments' reputation for excellence and invest in the 74AUC16240DGVRG4 for all your connectivity needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the bus driver & transceivers, making it a reliable choice for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation onto PCBs, saving time and effort during assembly.

No. of Functions: 4

Having 4 functions in a single component reduces the need for multiple separate components, thus saving space and simplifying the design.

Package Shape: RECTANGULAR

Rectangular shape enables easy integration into circuit designs and ensures compatibility with standard PCB layouts.

Nominal Supply Voltage / Vsup (V): 1.2

Operating at a low nominal supply voltage of 1.2V results in lower power consumption, making the product energy-efficient.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the bus driver & transceivers can withstand elevated environmental conditions, ensuring reliability in various applications.

Technical Specifications

Bus Driver & Transceivers 74AUC16240DGVRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

AUC

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

9.7 mm

Logic IC Type:

Maximum I (ol):

5 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/2.5

Propagation Delay (tpd):

2.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74AUC16240DGVRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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