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74AUC1G125DBVRE4

Texas Instruments

74AUC1G125DBVRE4 by Texas Instruments

74AUC1G125DBVRE4 by Texas Instruments is a bus driver with 3.6 ns propagation delay, suitable for industrial applications. It operates at 1.2/2.5 V power supplies, has a load capacitance of 15 pF, and features a small outline package style.

Median Price

$1.940

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 5,620 parts In-Stock

1+ parts

$1.940

100+ parts

$0.752

1k+ parts

$0.513

10k+ parts

$0.329

5,620

$1.940

$0.752

$0.513

$0.329

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,181 parts In-Stock

1+ parts

$0.082

100+ parts

-

1k+ parts

-

10k+ parts

-

1,181

$0.082

-

-

-

Digiode

USA . 3,197 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,197

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 5,996 parts In-Stock

1+ parts

$0.420

100+ parts

$0.200

1k+ parts

$0.110

10k+ parts

-

5,996

$0.420

$0.200

$0.110

-

Parana Technologies

USA . 1,042 parts In-Stock

1+ parts

$11.007

100+ parts

-

1k+ parts

$11.468

10k+ parts

-

1,042

$11.007

-

$11.468

-

DigiPath Technology Company

USA . 1,795 parts In-Stock

1+ parts

$12.120

100+ parts

-

1k+ parts

-

10k+ parts

-

1,795

$12.120

-

-

-

ChromeModa Solutions

Germany . 6,602 parts In-Stock

1+ parts

$12.367

100+ parts

$10.141

1k+ parts

-

10k+ parts

-

6,602

$12.367

$10.141

-

-

IDEA Electronic Components Group

UK . 1,030 parts In-Stock

1+ parts

$12.367

100+ parts

$11.749

1k+ parts

$11.130

10k+ parts

-

1,030

$12.367

$11.749

$11.130

-

Native Components

USA . 896 parts In-Stock

1+ parts

$26.600

100+ parts

-

1k+ parts

-

10k+ parts

-

896

$26.600

-

-

-

Northwest PG Solutions

USA . 2,110 parts In-Stock

1+ parts

$29.260

100+ parts

$26.334

1k+ parts

-

10k+ parts

-

2,110

$29.260

$26.334

-

-

Andel Nordic

Denmark . 197 parts In-Stock

1+ parts

$77.222

100+ parts

-

1k+ parts

$74.133

10k+ parts

$74.133

197

$77.222

-

$74.133

$74.133

Microchip USA

USA . 1,471 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,471

-

-

-

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Corphita

USA . 1,056 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,056

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-

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Overview

Experience unparalleled quality with the 74AUC1G125DBVRE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch Bus Driver & Transceivers that are perfect for a wide range of applications. Enjoy the benefits of fast propagation delay, low power consumption, and reliable performance. With a compact package design and versatile features, this product offers exceptional value to customers looking for high-quality electronic components. Trust Texas Instruments for all your semiconductor needs and elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and resistance to external elements, ensuring the longevity of the bus driver & transceivers.

Propagation Delay At Nominal Supply: 3.6 ns

Low propagation delay ensures fast and efficient signal transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Surface mount capability enables easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 1.2

Operates at a low nominal supply voltage of 1.2V, making it energy-efficient and compatible with various power sources.

Load Capacitance (CL): 15 pF

Suitable load capacitance of 15pF ensures stable and reliable performance in different circuit configurations.

Output Characteristics: 3-STATE

3-state output allows the bus driver & transceivers to control the bus lines, enabling multiple devices to share the same communication lines effectively.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range of -40°C to 85°C ensures reliable operation in harsh environments, making it suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the bus driver & transceivers.

Technical Specifications

Bus Driver & Transceivers 74AUC1G125DBVRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AUC

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

9 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/2.5

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

3.6 ns

Propagation Delay (tpd):

3.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

1.6 mm

Trade Compliance

74AUC1G125DBVRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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