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74ABT16373BDL,118

NXP Semiconductors

74ABT16373BDL,118 by NXP Semiconductors

NXP Semiconductors' 74ABT16373BDL,118 is an 8-bit bus driver with a propagation delay of 4.4 ns at 5V supply voltage. It features a small outline package, operates in industrial temperature range (-40 to 85 °C), and has dual terminal position. Ideal for applications requiring fast signal transmission and low power consumption.

Median Price

$1.000

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,971 parts In-Stock

1+ parts

-

100+ parts

$1.000

1k+ parts

$0.830

10k+ parts

$0.740

5,971

-

$1.000

$0.830

$0.740

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.397

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-

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100

$0.397

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Digiode

USA . 4,143 parts In-Stock

1+ parts

$0.401

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4,143

$0.401

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Vyrian

USA . 10,530 parts In-Stock

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10,530

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VNN

France . 4,723 parts In-Stock

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4,723

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Anansix

USA . 2,555 parts In-Stock

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2,555

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ACDS - Activité Composants Distribution Service

France . 100 parts In-Stock

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100

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Distributors (Availability)

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Ampacity Inc.

Singapore . 5,970 parts In-Stock

1+ parts

$0.359

100+ parts

-

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5,970

$0.359

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Corphita

USA . 1,135 parts In-Stock

1+ parts

$0.380

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1,135

$0.380

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Netroflash

USA . 500 parts In-Stock

1+ parts

$0.397

100+ parts

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500

$0.397

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Microchip USA

USA . 358 parts In-Stock

1+ parts

$7.670

100+ parts

$7.670

1k+ parts

$7.670

10k+ parts

$7.670

358

$7.670

$7.670

$7.670

$7.670

AZTECH Wire

Italy . 128 parts In-Stock

1+ parts

$21.640

100+ parts

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128

$21.640

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Advanced Electronics

New Zealand . 3,237 parts In-Stock

1+ parts

$29.345

100+ parts

$29.052

1k+ parts

$27.878

10k+ parts

-

3,237

$29.345

$29.052

$27.878

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Continental Prestige Electronics

USA . 5,971 parts In-Stock

1+ parts

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100+ parts

$0.510

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5,971

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$0.510

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UNI Independent Distributors

Spain . 4,653 parts In-Stock

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Perfect Parts

USA . 339 parts In-Stock

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339

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Cyclops Electronics Ltd (Excess)

UK . 100 parts In-Stock

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100

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Overview

Elevate your electronic designs with the 74ABT16373BDL,118 from NXP Semiconductors. This high-quality Bus Driver & Transceiver offers reliable performance and versatility for a variety of applications. With a compact design and efficient power usage, this product provides exceptional value to customers looking for seamless integration and optimal functionality in their projects. Trust NXP Semiconductors for cutting-edge technology and superior solutions in the world of semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, which is important for applications where weight and robustness are important factors.

Propagation Delay At Nominal Supply: 4.4 ns

Low propagation delay ensures fast and efficient data transmission, making this product suitable for high-speed communication systems.

Surface Mount: YES

Surface mount capability makes the product easy to integrate into circuit boards, saving space and simplifying the assembly process.

No. of Functions: 2

Having multiple functions in a single integrated device reduces the need for multiple components, leading to a more streamlined and cost-effective design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes the product compatible with a wide range of systems and power sources.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures optimal performance and signal integrity in the circuit, especially in high-speed applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows the product to function reliably in various environmental conditions, making it suitable for industrial applications.

Technology: BICMOS

Utilizing BiCMOS technology combines the advantages of both bipolar and CMOS technologies, providing high-speed performance and low power consumption.

Technical Specifications

Bus Driver & Transceivers 74ABT16373BDL,118 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Family:

ABT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

15.875 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

19 mA

Propagation Delay At Nominal Supply:

4.4 ns

Propagation Delay (tpd):

4.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.8 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

74ABT16373BDL,118 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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