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MT25QL02GCBB8E12-0SIT

Micron Technology

MT25QL02GCBB8E12-0SIT by Micron Technology

Micron Technology's MT25QL02GCBB8E12-0SIT is a 256MX8 NOR flash memory with 3V supply voltage, operating at up to 133MHz clock frequency. Ideal for industrial applications, it offers 100K write/erase cycles, SPI serial bus type, and compact dimensions of 6mm x 8mm.

Median Price

$27.050

Lifecycle Status

Suppliers In-Stock

24

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Element14

Singapore . 5,148 parts In-Stock

1+ parts

$24.428

100+ parts

-

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5,148

$24.428

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Mouser Electronics

USA . 2,286 parts In-Stock

1+ parts

$27.050

100+ parts

$21.340

1k+ parts

$21.220

10k+ parts

-

2,286

$27.050

$21.340

$21.220

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Arrow

USA . 3,856 parts In-Stock

1+ parts

$28.720

100+ parts

-

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3,856

$28.720

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Newark

USA . 1,120 parts In-Stock

1+ parts

$45.370

100+ parts

$38.660

1k+ parts

$37.380

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1,120

$45.370

$38.660

$37.380

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Farnell

UK . 4,932 parts In-Stock

1+ parts

$47.139

100+ parts

$38.077

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4,932

$47.139

$38.077

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Verical

USA . 6,732 parts In-Stock

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$19.360

6,732

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$19.360

EBV Elektronik

Germany . 5,610 parts In-Stock

1+ parts

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5,610

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Future Electronics

Canada . 5,610 parts In-Stock

1+ parts

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100+ parts

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$14.900

10k+ parts

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5,610

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$14.900

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 8 parts In-Stock

1+ parts

$15.450

100+ parts

-

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8

$15.450

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DF Sales Co.

USA . 8 parts In-Stock

1+ parts

$15.450

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8

$15.450

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Digiode

USA . 1,667 parts In-Stock

1+ parts

$20.682

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1,667

$20.682

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$29.945

100+ parts

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100

$29.945

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Bristol Electronics

USA . 7,500 parts In-Stock

1+ parts

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7,500

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Cyclops Electronics Ltd

UK . 5,497 parts In-Stock

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5,497

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J2 Sourcing AB

Sweden . 5,000 parts In-Stock

1+ parts

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5,000

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TME

Poland . 4,488 parts In-Stock

1+ parts

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$26.833

4,488

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$26.833

Chip Stock

USA . 4,000 parts In-Stock

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4,000

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Vyrian

USA . 3,061 parts In-Stock

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3,061

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BCID Electronics Ltd.

Israel . 934 parts In-Stock

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934

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NAC Semi

USA . 768 parts In-Stock

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768

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Sensible Micro Corp

USA . 89 parts In-Stock

1+ parts

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89

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LIBRA Elektronik GmbH

Germany . 50 parts In-Stock

1+ parts

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50

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Prism Electronics

USA . 33 parts In-Stock

1+ parts

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33

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ComSIT Distribution GmbH

Germany . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 3,142 parts In-Stock

1+ parts

$2.060

100+ parts

-

1k+ parts

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10k+ parts

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3,142

$2.060

-

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Corohmni

South Africa . 272 parts In-Stock

1+ parts

$2.504

100+ parts

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272

$2.504

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Advanced Electronics

New Zealand . 80 parts In-Stock

1+ parts

$5.103

100+ parts

$4.847

1k+ parts

$4.847

10k+ parts

-

80

$5.103

$4.847

$4.847

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Semicontronic

India . 7,114 parts In-Stock

1+ parts

$18.500

100+ parts

$18.038

1k+ parts

$17.945

10k+ parts

-

7,114

$18.500

$18.038

$17.945

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Corphita

USA . 1,550 parts In-Stock

1+ parts

$19.593

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1,550

$19.593

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Continental Prestige Electronics

USA . 5,118 parts In-Stock

1+ parts

$24.770

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5,118

$24.770

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Bastille Electronics

Australia . 36 parts In-Stock

1+ parts

$29.940

100+ parts

$28.443

1k+ parts

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$26.647

36

$29.940

$28.443

-

$26.647

Ampacity Inc.

Singapore . 3,165 parts In-Stock

1+ parts

$40.270

100+ parts

-

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3,165

$40.270

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Infinite Electronics LLP (Excess)

. 10,765 parts In-Stock

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10,765

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iBuyXS LLC

. 7,500 parts In-Stock

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7,500

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Perfect Parts

USA . 6,283 parts In-Stock

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6,283

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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GreenTree Electronics

Israel . 4,820 parts In-Stock

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4,820

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Argo Parts USA

USA . 1,335 parts In-Stock

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1,335

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Kepictronics

USA . 1,122 parts In-Stock

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1,122

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A-Z Elektronik GmbH

Germany . 1,122 parts In-Stock

1+ parts

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1,122

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Speed Components Ltd (Excess)

Israel . 674 parts In-Stock

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674

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Robosynatics

Brazil . 200 parts In-Stock

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200

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Lucentia Tech

USA . 200 parts In-Stock

1+ parts

-

100+ parts

$0.040

1k+ parts

$0.040

10k+ parts

$0.040

200

-

$0.040

$0.040

$0.040

Overview

Experience lightning-fast data storage and retrieval with the MT25QL02GCBB8E12-0SIT by Micron Technology. Known for their high-quality products, Micron Technology brings you this cutting-edge flash memory solution that is perfect for industrial applications. With 256MX8 organization and a 3-STATE output, this NOR type memory offers 100000 write/erase cycles, ensuring durability and reliability. Whether you need hardware or software write protection, this thin-profile grid array package provides the performance and speed you need. Upgrade your system today with Micron Technology's MT25QL02GCBB8E12-0SIT for unmatched value and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the flash memory, ensuring a longer lifespan.

Surface Mount: YES

Easy to integrate into circuit boards without the need for additional mounting hardware.

Operating Mode: SYNCHRONOUS

Allows for faster data transfer rates and synchronous communication with other components.

Nominal Supply Voltage / Vsup (V): 3

Optimal voltage for stable performance and efficient power consumption.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications that require reliable operation in high-temperature environments.

Output Characteristics: 3-STATE

Allows the output to be in a high-impedance state, providing flexibility in connecting multiple devices.

Minimum Operating Temperature: -40 °C

Can withstand extreme cold temperatures, making it suitable for a wide range of operating conditions.

Write Protection: HARDWARE/SOFTWARE

Offers multiple levels of security to prevent unauthorized data modification or deletion.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during the manufacturing process with a limited exposure to high temperatures.

Endurance: 100000 Write/Erase Cycles

Can handle a high number of write and erase cycles, making it reliable for repeated data storage and retrieval.

Technical Specifications

Flash Memory MT25QL02GCBB8E12-0SIT attributes and parameters. Explore more Flash Memory devices from Micron Technology

Specs

Boot Block:

BOTTOM/TOP

Maximum Clock Frequency (fCLK):

133 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PBGA-B24

JESD-609 Code:

e1

Length:

8 mm

Memory Density:

2147483648 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

24

No. of Words:

268435456 words

No. of Words Code:

256M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA24,5X5,40

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Programming Voltage (V):

3

Maximum Seated Height:

1.2 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00013 Amp

Maximum Supply Current:

94 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Type:

NOR TYPE

Width:

6 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

MT25QL02GCBB8E12-0SIT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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