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MT41K256M8DA-125AIT:K

Micron Technology

MT41K256M8DA-125AIT:K by Micron Technology

Micron Technology's MT41K256M8DA-125AIT:K is a DDR3L DRAM with 256MX8 organization, operating at 800 MHz. It features a thin profile grid array package and operates at temperatures ranging from -40 to 85 °C. Ideal for industrial applications requiring high-speed synchronous memory with self-refresh capabilities.

Median Price

$5.378

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,457 parts In-Stock

1+ parts

$5.250

100+ parts

$4.390

1k+ parts

$4.100

10k+ parts

-

2,457

$5.250

$4.390

$4.100

-

DigiKey

USA . 820 parts In-Stock

1+ parts

$5.250

100+ parts

$4.557

1k+ parts

$4.287

10k+ parts

$4.104

820

$5.250

$4.557

$4.287

$4.104

Arrow

USA . 172 parts In-Stock

1+ parts

$5.506

100+ parts

-

1k+ parts

-

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172

$5.506

-

-

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Newark

USA . 921 parts In-Stock

1+ parts

$15.850

100+ parts

-

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921

$15.850

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Verical

USA . 172 parts In-Stock

1+ parts

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172

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Distributors (In-Stock)

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Digiode

USA . 1,289 parts In-Stock

1+ parts

$5.231

100+ parts

-

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1,289

$5.231

-

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$8.388

100+ parts

-

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300

$8.388

-

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Chip Stock

USA . 18,300 parts In-Stock

1+ parts

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18,300

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NAC Semi

USA . 1,069 parts In-Stock

1+ parts

-

100+ parts

$5.680

1k+ parts

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1,069

-

$5.680

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Vyrian

USA . 953 parts In-Stock

1+ parts

-

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953

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ComSIT Distribution GmbH

Germany . 103 parts In-Stock

1+ parts

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103

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Mil-Aero Solutions, Inc.

USA . 60 parts In-Stock

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60

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Bisco

USA . 20 parts In-Stock

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20

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Distributors (Availability)

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Corohmni

South Africa . 731 parts In-Stock

1+ parts

$2.003

100+ parts

-

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10k+ parts

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731

$2.003

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Component Stockers USA

USA . 2,673 parts In-Stock

1+ parts

$2.120

100+ parts

$2.010

1k+ parts

$2.380

10k+ parts

-

2,673

$2.120

$2.010

$2.380

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Aztec Data Supply Inc.

USA . 2,215 parts In-Stock

1+ parts

$3.930

100+ parts

-

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2,215

$3.930

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Semicontronic

India . 4,950 parts In-Stock

1+ parts

$4.460

100+ parts

$4.348

1k+ parts

$4.326

10k+ parts

-

4,950

$4.460

$4.348

$4.326

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Ampacity Inc.

Singapore . 1,610 parts In-Stock

1+ parts

$4.460

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1,610

$4.460

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Corphita

USA . 807 parts In-Stock

1+ parts

$4.955

100+ parts

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807

$4.955

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Continental Prestige Electronics

USA . 5,226 parts In-Stock

1+ parts

$8.388

100+ parts

-

1k+ parts

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10k+ parts

$8.220

5,226

$8.388

-

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$8.220

GreenTree Electronics

Israel . 10,511 parts In-Stock

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10,511

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Microchip USA

USA . 1,575 parts In-Stock

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1,575

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Argo Parts USA

USA . 228 parts In-Stock

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228

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Futuretech Components

Singapore . 213 parts In-Stock

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Perfect Parts

USA . 112 parts In-Stock

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112

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Kepictronics

USA . 85 parts In-Stock

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85

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Overview

Experience seamless performance and reliability with the MT41K256M8DA-125AIT:K by Micron Technology. As a leading manufacturer in the industry, Micron Technology delivers top-quality DRAM products like this one that are perfect for a wide range of applications. With a focus on efficiency and innovation, this DDR3L DRAM memory offers unparalleled value and benefits to customers looking for a high-performance solution. Upgrade your system today with Micron Technology and experience the difference in speed and reliability.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and reliability to the product.

Surface Mount:

YES - Allows for easy and efficient installation on circuit boards.

No. of Functions:

1 - Simplifies the design and integration process.

Screening Level:

AEC-Q100 - Ensures high quality and performance standards.

Package Shape:

RECTANGULAR - Offers a versatile and space-saving design.

Operating Mode:

SYNCHRONOUS - Provides efficient data transfer and processing.

Self Refresh:

YES - Helps in reducing power consumption during standby mode.

Input/Output Type:

COMMON - Enables easy communication with other components.

Nominal Supply Voltage / Vsup (V):

1.35 - Provides stable power supply for optimal performance.

Power Supplies (V):

1.35 - Supports the overall power requirement of the device.

Technical Specifications

DRAM MT41K256M8DA-125AIT:K attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

MULTI BANK PAGE BURST

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

800 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

8

JESD-30 Code:

R-PBGA-B78

Length:

10.5 mm

Memory Density:

2147483648 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

78

No. of Words:

268435456 words

No. of Words Code:

256M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA78,9X13,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Power Supplies (V):

1.35

Qualification:

Not Qualified

Refresh Cycles:

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

8

Maximum Standby Current:

.012 Amp

Sub-Category:

DRAMs

Maximum Supply Current:

195 mA

Maximum Supply Voltage (Vsup):

1.45 V

Minimum Supply Voltage (Vsup):

1.283 V

Nominal Supply Voltage / Vsup (V):

1.35

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Trade Compliance

MT41K256M8DA-125AIT:K Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.36

SB

8542.32.00.23

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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