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VN2406L-GP013

Microchip Technology

VN2406L-GP013 by Microchip Technology

VN2406L-GP013 by Microchip is a N-CHANNEL FET with 240V DS breakdown voltage and 0.19A max drain current. Ideal for switching applications, it operates in enhancement mode with 1W power dissipation, -55 to 150 °C temp range, and 6 ohm max on resistance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Vyrian

USA . 964 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Aztec Data Supply Inc.

USA . 250 parts In-Stock

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$0.543

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250

$0.543

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Corohmni

South Africa . 70 parts In-Stock

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$1.386

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AZTECH Wire

Italy . 669 parts In-Stock

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$11.993

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$11.993

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Ampacity Inc.

Singapore . 1,571 parts In-Stock

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$60.050

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West Coast Incorporated

USA . 7,170 parts In-Stock

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Continental Prestige Electronics

USA . 3,529 parts In-Stock

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3,529

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Argo Parts USA

USA . 2,566 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Overview

Enhance your electronics projects with the VN2406L-GP013 by Microchip Technology. This high-quality small signal field effect transistor offers unmatched reliability and performance, making it ideal for a variety of switching applications. With its N-channel configuration and built-in diode, this transistor provides seamless operation and efficient power management. Trust in Microchip Technology's expertise to deliver a product that exceeds expectations, offering exceptional value and benefits to customers looking for top-notch electronic components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics than P-channel FETs, making this transistor a reliable choice for various applications.

Minimum DS Breakdown Voltage: 240 V

High breakdown voltage allows this transistor to be used in applications where voltage spikes may occur without getting damaged.

Transistor Application: SWITCHING

Designed specifically for switching applications, making it efficient and reliable in controlling the flow of current.

Maximum Power Dissipation (Abs): 1 W

The high power dissipation capability ensures that the transistor can handle moderate power levels without overheating.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures, making it suitable for applications where heat dissipation is a concern.

Maximum Drain Current (ID): 0.19 A

Capable of handling a relatively high current, which is important for certain applications that require a higher flow of current.

Maximum Drain-Source On Resistance: 6 ohm

Low on-resistance means less power dissipation and efficient switching characteristics, making it suitable for high-frequency switching applications.

Maximum Feedback Capacitance (Crss): 20 pF

Low feedback capacitance helps in reducing unwanted capacitive coupling and interference in circuits, ensuring better overall performance.

Technical Specifications

Small Signal Field Effect Transistors (FET) VN2406L-GP013 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Microchip Technology

Specs

Minimum DS Breakdown Voltage:

240 V

Maximum Drain Current (ID):

.19 A

Maximum Drain-Source On Resistance:

6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

20 pF

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

1 W

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

VN2406L-GP013 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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