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VN2406L-GP005

Microchip Technology

VN2406L-GP005 by Microchip Technology

VN2406L-GP005 by Microchip is a N-CHANNEL FET with 240V DS Breakdown Voltage. Ideal for SWITCHING applications, it has a Max Power Dissipation of 1W and operates in ENHANCEMENT MODE. With a Max Operating Temperature of 150°C, this FET features a Drain Current of 0.19A and Drain-Source On Resistance of 6Ω.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 450 parts In-Stock

1+ parts

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450

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 45 parts In-Stock

1+ parts

$0.316

100+ parts

-

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45

$0.316

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Aztec Data Supply Inc.

USA . 152 parts In-Stock

1+ parts

$1.836

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152

$1.836

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Ampacity Inc.

Singapore . 674 parts In-Stock

1+ parts

$14.050

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674

$14.050

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AZTECH Wire

Italy . 786 parts In-Stock

1+ parts

$16.960

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786

$16.960

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Fulton Briggs Corp.

USA . 5,411 parts In-Stock

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5,411

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Continental Prestige Electronics

USA . 3,604 parts In-Stock

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3,604

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Argo Parts USA

USA . 1,290 parts In-Stock

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1,290

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Overview

Discover the unparalleled quality and reliability of the VN2406L-GP005 by Microchip Technology, a leading manufacturer in the industry. This small signal field effect transistor offers exceptional performance in switching applications, with a built-in diode for added convenience. With a maximum power dissipation of 1W and a minimum DS breakdown voltage of 240V, this transistor is designed to deliver superior functionality and efficiency. Trust Microchip Technology to provide you with a cutting-edge solution that meets your needs and exceeds your expectations. Experience the difference with the VN2406L-GP005 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material makes the transistor easy to handle and install.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have faster switching speeds and higher power efficiency compared to P-channel transistors.

Minimum DS Breakdown Voltage: 240 V

High breakdown voltage allows for reliable operation in high voltage applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in such scenarios.

Maximum Power Dissipation (Abs): 1 W

Can handle power dissipation of up to 1 watt, suitable for various low to medium power applications.

Maximum Operating Temperature: 150 °C

Wide operating temperature range allows for usage in diverse environmental conditions.

Maximum Drain Current (ID): 0.19 A

Able to handle drain currents up to 0.19 amps, suitable for many low current applications.

Maximum Drain-Source On Resistance: 6 ohm

Low on-resistance ensures efficient power handling and minimal voltage drop across the transistor.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Common and reliable MOSFET technology is used in this transistor for consistent performance.

Maximum Feedback Capacitance (Crss): 20 pF

Low feedback capacitance helps minimize signal distortion and improve overall performance.

Technical Specifications

Small Signal Field Effect Transistors (FET) VN2406L-GP005 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Microchip Technology

Specs

Minimum DS Breakdown Voltage:

240 V

Maximum Drain Current (ID):

.19 A

Maximum Drain-Source On Resistance:

6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

20 pF

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

1 W

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

VN2406L-GP005 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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