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VN2406L-GP003

Microchip Technology

VN2406L-GP003 by Microchip Technology

VN2406L-GP003 by Microchip is a N-CHANNEL FET with 240V DS breakdown voltage, ideal for SWITCHING applications. It features a single configuration with built-in diode and operates in ENHANCEMENT MODE. With 1W power dissipation and -55 to 150 °C operating temperature range, it offers reliable performance in various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,197 parts In-Stock

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1,197

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Aztec Data Supply Inc.

USA . 134 parts In-Stock

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$1.486

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134

$1.486

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Corohmni

South Africa . 699 parts In-Stock

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$1.553

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699

$1.553

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Ampacity Inc.

Singapore . 1,028 parts In-Stock

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$4.050

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$4.050

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AZTECH Wire

Italy . 199 parts In-Stock

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$11.499

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199

$11.499

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Fulton Briggs Corp.

USA . 7,805 parts In-Stock

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Continental Prestige Electronics

USA . 5,302 parts In-Stock

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Argo Parts USA

USA . 656 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

The VN2406L-GP003 by Microchip Technology is a top-quality Small Signal Field Effect Transistor (FET) that offers unparalleled performance and reliability. Ideal for switching applications, this N-CHANNEL transistor boasts a built-in diode for added convenience. With a maximum DS breakdown voltage of 240V and a maximum drain current of 0.19A, this FET delivers exceptional power while maintaining efficient operation. Trust Microchip Technology to provide cutting-edge technology in a compact, durable package. Elevate your projects with the VN2406L-GP003 and experience superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

Offers versatile usage and compatibility with a wide range of circuits and systems.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space, making it ideal for compact electronic devices.

Transistor Application: SWITCHING

Ensures efficient and reliable performance in switching applications, improving overall system functionality.

Minimum DS Breakdown Voltage: 240 V

Withstands high voltage levels, ensuring the transistor can handle demanding operating conditions.

Package Shape: ROUND

Allows for easy installation and integration into circuit boards with limited space.

Terminal Form: THROUGH-HOLE

Facilitates secure and stable connections, enhancing the overall reliability of the transistor.

Operating Mode: ENHANCEMENT MODE

Provides flexibility in controlling the transistor's operation, allowing for precise adjustment in various scenarios.

No. of Terminals: 3

Simplifies circuit design and installation, making it user-friendly for both beginners and experienced professionals.

Maximum Power Dissipation (Abs): 1 W

Offers sufficient power handling capability, ensuring the transistor can operate effectively without overheating.

Package Style (Meter): CYLINDRICAL

Provides a compact and space-efficient packaging solution for tight circuit board layouts.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Delivers high performance and efficiency, making the transistor a reliable choice for demanding applications.

Maximum Operating Temperature: 150 °C

Ensures reliable operation in a wide range of environmental conditions, enhancing the product's overall durability.

Transistor Element Material: SILICON

Provides excellent thermal stability and performance, making the transistor suitable for long-term use.

Minimum Operating Temperature: -55 °C

Allows for operation in cold environments without compromising performance, increasing the versatility of the transistor.

Maximum Drain Current (ID): 0.19 A

Provides sufficient current handling capacity for various applications, ensuring reliable operation under different load conditions.

Maximum Drain-Source On Resistance: 6 ohm

Offers low resistance for efficient power flow, improving the overall performance of the transistor.

Terminal Position: BOTTOM

Facilitates easy installation and connection, enhancing the user experience during assembly and maintenance.

Maximum Feedback Capacitance (Crss): 20 pF

Helps reduce signal distortion and improve overall signal integrity, making the transistor suitable for high-frequency applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) VN2406L-GP003 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Microchip Technology

Specs

Minimum DS Breakdown Voltage:

240 V

Maximum Drain Current (ID):

.19 A

Maximum Drain-Source On Resistance:

6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

20 pF

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

1 W

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

VN2406L-GP003 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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