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PIC24EP512GU814T-I/PH

Microchip Technology

PIC24EP512GU814T-I/PH by Microchip Technology

PIC24EP512GU814T-I/PH by Microchip is a 16-bit DSP with 60 MHz clock frequency, 53248 RAM words, and 320 mA max supply current. Ideal for industrial applications, it features 9 timers, 15 DMA channels, and FLASH ROM programmability for efficient digital signal processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,418 parts In-Stock

1+ parts

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4,418

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Chip Stock

USA . 2,710 parts In-Stock

1+ parts

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1k+ parts

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2,710

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Nova Conductors

Japan . 35 parts In-Stock

1+ parts

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35

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,803 parts In-Stock

1+ parts

$10.750

100+ parts

-

1k+ parts

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10k+ parts

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2,803

$10.750

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AZTECH Wire

Italy . 322 parts In-Stock

1+ parts

$20.440

100+ parts

-

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322

$20.440

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Fulton Briggs Corp.

USA . 1,810 parts In-Stock

1+ parts

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1,810

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Netroflash

USA . 1,000 parts In-Stock

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1,000

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Overview

Enhance your digital signal processing capabilities with the Microchip Technology PIC24EP512GU814T-I/PH. Designed with cutting-edge technology, this DSP offers unparalleled performance and reliability. From industrial automation to consumer electronics, this versatile device caters to a wide range of applications. With a focus on quality and innovation, Microchip Technology ensures that you get the best value for your investment. Experience the benefits of seamless operation, superior functionality, and efficient power consumption with the PIC24EP512GU814T-I/PH. Elevate your projects to new heights with this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the DSP, making it suitable for various environments and conditions.

Maximum Supply Voltage: 3.6 V

Allows for a higher voltage input, providing flexibility and compatibility with different power sources.

RAM Words: 53248

Large RAM capacity allows for efficient data processing and storage, enhancing the performance of the DSP.

Maximum Clock Frequency: 60 MHz

High clock frequency enables fast processing of signals, making the DSP suitable for real-time applications.

ROM Programmability: FLASH

Flash ROM allows for easy programming and updating of software in the DSP, facilitating customization and adaptability.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making the DSP energy-efficient and reliable.

Technical Specifications

Digital Signal Processors (DSPs) PIC24EP512GU814T-I/PH attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

15

No. of External Interrupts:

5

No. of Serial I/Os:

0

No. of Terminals:

144

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP144,.7SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

53248

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Sub-Category:

Microcontrollers

Maximum Supply Current:

320 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

16 mm

Trade Compliance

PIC24EP512GU814T-I/PH Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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